EP 1317763 B1 20080514 - FUSE LINK, METHOD FOR THE PRODUCTION THEREOF AND SOLDERING SUBSTANCE
Title (en)
FUSE LINK, METHOD FOR THE PRODUCTION THEREOF AND SOLDERING SUBSTANCE
Title (de)
SICHERUNGSEINSATZ, VERFAHREN ZU SEINER HERSTELLUNG UND LOTSUBSTANZ
Title (fr)
CARTOUCHE FUSIBLE, SON PROCEDE DE PRODUCTION, AINSI QUE SUBSTANCE DE BRASURE
Publication
Application
Priority
- EP 01980371 A 20010911
- EP 0110499 W 20010911
- EP 00119932 A 20000913
Abstract (en)
[origin: EP1189252A1] Fuse insert comprises a molten conductor with a soldering material in a solder depot of a support, the solder being based on tin and the support on copper. The solder contains a tin alloy with a larger first component but smaller than the amount of the tin base material and a second smaller component which does not dissolve in the tin. Crystallization seeds are produced during cooling from liquid into the solid state to form a fine structure. Preferred Features: The soldering material is a tin-bismuth-copper alloy, a tin-indium-copper alloy or a tin-bismuth-iron alloy.
IPC 8 full level
H01H 85/11 (2006.01)
CPC (source: EP US)
H01H 85/11 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated extension state (EPC)
SI
DOCDB simple family (publication)
EP 1189252 A1 20020320; AT E395715 T1 20080515; BR 0113834 A 20040928; BR PI0113834 B1 20150915; CN 100350539 C 20071121; CN 1455942 A 20031112; CZ 20031036 A3 20030917; CZ 299341 B6 20080625; DE 50113976 D1 20080626; EP 1317763 A1 20030611; EP 1317763 B1 20080514; ES 2302752 T3 20080801; HU 226335 B1 20080929; HU P0300734 A2 20030929; HU P0300734 A3 20051228; PL 202046 B1 20090529; PL 362409 A1 20041102; SI 1317763 T1 20081031; US 2004027226 A1 20040212; US 7109839 B2 20060919; WO 0223575 A1 20020321
DOCDB simple family (application)
EP 00119932 A 20000913; AT 01980371 T 20010911; BR 0113834 A 20010911; CN 01815603 A 20010911; CZ 20031036 A 20010911; DE 50113976 T 20010911; EP 0110499 W 20010911; EP 01980371 A 20010911; ES 01980371 T 20010911; HU P0300734 A 20010911; PL 36240901 A 20010911; SI 200130845 T 20010911; US 38023803 A 20030313