EP 1317875 A1 20030611 - METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE ON A NON-PLANAR SURFACE AND THE USE OF SAID METHOD
Title (en)
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE ON A NON-PLANAR SURFACE AND THE USE OF SAID METHOD
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER ELEKTRISCH LEITFÄHIGEN STRUKTUR AUF EINER NICHTPLANEN OBERFLÄCHE UND VERWENDUNG DES VERFAHRENS
Title (fr)
PROCEDE POUR REALISER UNE STRUCTURE ELECTROCONDUCTRICE SUR UNE SURFACE NON PLANE, ET MISE EN OEUVRE DE CE PROCEDE
Publication
Application
Priority
- DE 0103166 W 20010817
- DE 10045072 A 20000912
Abstract (en)
[origin: WO0223961A1] The invention relates to a method for producing an electrically conductive structure on a non-planar surface (1) comprising the following steps: a) electrochemical deposition of a photo resist layer (2) on the surface (1) b) exposure of sections of the photo resist layer (2) c) removal of one section of the photo resist layer (2) by a developing process d) deposition of an electrically conductive material (3) on the sections of the surface (1) that are devoid of the photo resist layer (2). The invention also relates to a method for producing miniaturised coils. The electrochemical deposition of the photo resist on the non-planar surface enables an extremely uniform thickness to be achieved for the layer.
IPC 1-7
IPC 8 full level
G03F 7/09 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/40 (2006.01); H01F 41/04 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01); H05K 1/00 (2006.01); H05K 3/10 (2006.01); H05K 3/40 (2006.01)
CPC (source: EP US)
G03F 7/164 (2013.01 - EP US); H01F 41/041 (2013.01 - EP US); H05K 3/0082 (2013.01 - EP US); H05K 1/0284 (2013.01 - EP US); H05K 3/108 (2013.01 - EP US); H05K 3/403 (2013.01 - EP US); H05K 2201/09018 (2013.01 - EP US); H05K 2203/135 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0223961 A1 20020321; AU 8571001 A 20020326; CN 1283133 C 20061101; CN 1456032 A 20031112; DE 10045072 A1 20020404; EP 1317875 A1 20030611; JP 2004509455 A 20040325; US 2004096781 A1 20040520; US 6998222 B2 20060214
DOCDB simple family (application)
DE 0103166 W 20010817; AU 8571001 A 20010817; CN 01815517 A 20010817; DE 10045072 A 20000912; EP 01964918 A 20010817; JP 2002526808 A 20010817; US 38029303 A 20030311