EP 1319249 A2 20030618 - MODULE, ESPECIALLY A WAFER MODULE
Title (en)
MODULE, ESPECIALLY A WAFER MODULE
Title (de)
BAUGRUPPE, INSBESONDERE WAFER-BAUGRUPPE
Title (fr)
MODULE, EN PARTICULIER MODULE DE TRANCHES
Publication
Application
Priority
- DE 0102758 W 20010720
- DE 10037821 A 20000803
Abstract (en)
[origin: WO0213268A2] The module (10) is especially a wafer module and has two functional elements (11, 12) which lie opposite each other and which are functionally interconnected by a compression-deformable layer of a joining agent (13) located in-between them. The invention provides that at least one functional element (11; 12; 11, 12) is surface-structured in such a way as to form a depression (14) and that the functional connection lies exclusively in the area of this depression (14).
IPC 1-7
IPC 8 full level
H01L 21/58 (2006.01); H01L 23/10 (2006.01); H01L 29/06 (2006.01)
CPC (source: EP US)
H01L 24/32 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H01L 29/0657 (2013.01 - EP US); H01L 2224/32057 (2013.01 - EP US); H01L 2224/83139 (2013.01 - EP US); H01L 2224/8314 (2013.01 - EP US); H01L 2224/83141 (2013.01 - EP US); H01L 2224/8319 (2013.01 - EP US); H01L 2224/83385 (2013.01 - EP US); H01L 2224/8385 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01052 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/10158 (2013.01 - EP US)
Citation (search report)
See references of WO 0213268A2
Designated contracting state (EPC)
CH DE FR IT LI
DOCDB simple family (publication)
WO 0213268 A2 20020214; WO 0213268 A3 20020912; DE 10037821 A1 20020221; EP 1319249 A2 20030618; JP 2004506325 A 20040226; US 2004084398 A1 20040506
DOCDB simple family (application)
DE 0102758 W 20010720; DE 10037821 A 20000803; EP 01984504 A 20010720; JP 2002518527 A 20010720; US 34382003 A 20030702