Global Patent Index - EP 1320804 A2

EP 1320804 A2 20030625 - MEMORY MODULE HAVING BUFFER FOR ISOLATING STACKED MEMORY DEVICES

Title (en)

MEMORY MODULE HAVING BUFFER FOR ISOLATING STACKED MEMORY DEVICES

Title (de)

SPEICHERMODUL MIT DURCH EIN PUFFER ISOLIERETE GESTAPELTE SPEICHERBAUSTEINE

Title (fr)

MODULE DE MEMOIRE COMPORTANT UNE MEMOIRE TAMPON D'ISOLATION D'UNE MEMOIRE A PLAQUES SUPERPOSEES

Publication

EP 1320804 A2 20030625 (EN)

Application

EP 01968854 A 20010914

Priority

  • US 0128627 W 20010914
  • US 23259600 P 20000914
  • US 66652800 A 20000918

Abstract (en)

[origin: WO0225454A2] The present invention utilizes a buffer to isolate a stack of memory devices, thereby taking advantage of the increased memory density available from stacked memory devices while reducing capacitive loading. A memory module in accordance with the present invention may include a stack of memory devices and a buffer coupled to the first and second memory devices and arranged to capacitively isolate the first and second memory devices from a bus. In a memory system in accordance with the present invention, multiple buffered stacks of memory devices are preferably coupled in a point-to-point arrangement, thereby further reducing capacitive loading.

IPC 1-7

G06F 13/16

IPC 8 full level

G11C 5/00 (2006.01)

CPC (source: EP KR)

G06F 13/16 (2013.01 - KR); G11C 5/04 (2013.01 - EP); G11C 5/06 (2013.01 - EP)

Citation (search report)

See references of WO 0225454A2

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

WO 0225454 A2 20020328; WO 0225454 A3 20020822; AU 8906701 A 20020402; CN 1484833 A 20040324; EP 1320804 A2 20030625; KR 100554081 B1 20060222; KR 20030048036 A 20030618; TW 528948 B 20030421

DOCDB simple family (application)

US 0128627 W 20010914; AU 8906701 A 20010914; CN 01815663 A 20010914; EP 01968854 A 20010914; KR 20037003689 A 20030313; TW 90122785 A 20010913