Global Patent Index - EP 1320867 A2

EP 1320867 A2 2003-06-25 - REDUCING DEPOSITION OF PROCESS RESIDUES ON A SURFACE IN A CHAMBER

Title (en)

REDUCING DEPOSITION OF PROCESS RESIDUES ON A SURFACE IN A CHAMBER

Title (de)

REDUZIERUNG DES NIEDERSCHLAGS VON PROZESSABFÄLLE AUF OBERFLÄCHEN IN EINER PROZESSKAMMER

Title (fr)

REDUCTION DU DEPOT DE RESIDUS DE TRAITEMENT SUR UNE SURFACE A L'INTERIEUR D'UNE CHAMBRE

Publication

EP 1320867 A2 (EN)

Application

EP 01975321 A

Priority

  • US 0129802 W
  • US 66736200 A

Abstract (en)

[origin: WO0225696A2] A process chamber 35 capable of processing a substrate 30 and monitoring a process conducted on the substrate 30, comprises a support 45, a gas inlet, a gas energizer, an exhaust 85, and a wall 38 having a recess 145 that is sized to reduce the deposition of process residues therein. A process monitoring system 35 may be used to monitoring a process that may be conducted on a substrate 30 in the process chamber 25 through the recess 145 in the wall 38.

IPC 1-7 (main, further and additional classification)

H01J 37/32

IPC 8 full level (invention and additional information)

H05H 1/00 (2006.01); C23C 14/00 (2006.01); C23C 16/44 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H05H 1/46 (2006.01)

CPC (invention and additional information)

H01J 37/32458 (2013.01); H01J 37/32862 (2013.01); H01J 2237/022 (2013.01)

Citation (search report)

See references of WO 0225696A3

Designated contracting state (EPC)

AT BE CH CY DE DK FR GB IE IT LI NL

EPO simple patent family

WO 0225696 A2 20020328; WO 0225696 A3 20020815; WO 0225696 A9 20030327; EP 1320867 A2 20030625; JP 2004526293 A 20040826; KR 20030038763 A 20030516

INPADOC legal status


2006-10-25 [18D] APPLICATION DEEMED TO BE WITHDRAWN

- Effective date: 20060331

2004-05-19 [RBV] DESIGNATED CONTRACTING STATES (CORRECTION)

- Designated State(s): AT BE CH CY DE DK FR GB IE IT LI NL

2003-06-25 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20030417

2003-06-25 [AK] DESIGNATED CONTRACTING STATES:

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR