EP 1320867 A2 20030625 - REDUCING DEPOSITION OF PROCESS RESIDUES ON A SURFACE IN A CHAMBER
Title (en)
REDUCING DEPOSITION OF PROCESS RESIDUES ON A SURFACE IN A CHAMBER
Title (de)
REDUZIERUNG DES NIEDERSCHLAGS VON PROZESSABFÄLLE AUF OBERFLÄCHEN IN EINER PROZESSKAMMER
Title (fr)
REDUCTION DU DEPOT DE RESIDUS DE TRAITEMENT SUR UNE SURFACE A L'INTERIEUR D'UNE CHAMBRE
Publication
Application
Priority
- US 0129802 W 20010921
- US 66736200 A 20000921
Abstract (en)
[origin: WO0225696A2] A process chamber 35 capable of processing a substrate 30 and monitoring a process conducted on the substrate 30, comprises a support 45, a gas inlet, a gas energizer, an exhaust 85, and a wall 38 having a recess 145 that is sized to reduce the deposition of process residues therein. A process monitoring system 35 may be used to monitoring a process that may be conducted on a substrate 30 in the process chamber 25 through the recess 145 in the wall 38.
IPC 1-7
IPC 8 full level
C23C 14/00 (2006.01); C23C 16/44 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H05H 1/00 (2006.01); H05H 1/46 (2006.01)
CPC (source: EP KR)
H01J 37/32458 (2013.01 - EP); H01J 37/32862 (2013.01 - EP); H01L 21/3105 (2013.01 - KR); H01J 2237/022 (2013.01 - EP)
Citation (search report)
See references of WO 0225696A2
Designated contracting state (EPC)
AT BE CH CY DE DK FR GB IE IT LI NL
DOCDB simple family (publication)
WO 0225696 A2 20020328; WO 0225696 A3 20020815; WO 0225696 A9 20030327; EP 1320867 A2 20030625; JP 2004526293 A 20040826; KR 20030038763 A 20030516
DOCDB simple family (application)
US 0129802 W 20010921; EP 01975321 A 20010921; JP 2002529809 A 20010921; KR 20037004166 A 20030321