Global Patent Index - EP 1320873 A1

EP 1320873 A1 2003-06-25 - DEVICE AND METHOD FOR THE PLANAR CONNECTION OF TWO WAFERS FOR A THIN-GRINDING AND SEPARATION PROCESS OF A WAFER PRODUCT

Title (en)

DEVICE AND METHOD FOR THE PLANAR CONNECTION OF TWO WAFERS FOR A THIN-GRINDING AND SEPARATION PROCESS OF A WAFER PRODUCT

Title (de)

VORRICHTUNG UND VERFAHREN ZUM PLANEN VERBINDEN ZWEIER WAFER FÜR EIN DÜNNSCHLEIFEN UND EIN TRENNEN EINES PRODUKT-WAFERS

Title (fr)

DISPOSITIF ET PROCEDE POUR LA LIAISON PLANE DE DEUX PLAQUETTES POUR UN MEULAGE FIN ET UNE SEPARATION D'UNE PLAQUETTE-PRODUIT

Publication

EP 1320873 A1 (DE)

Application

EP 01982138 A

Priority

  • DE 0103683 W
  • DE 10048881 A

Abstract (en)

[origin: DE10048881A1] A device for planar connection of two wafers (1,2) together, includes a vacuum chamber (3), a chuck (4), a vacuum chamber cover (18) and a vacuum retaining device (19) for a wafer (1) which is arranged on the vacuum chamber cover such that the product wafer is arranged surface-congruently over the carrier wafer (2) and before joining of the product wafer and the carrier wafer, a spacing (a) is provided between them, such that the spacing is arranged in the vacuum chamber (3).

IPC 1-7 (main, further and additional classification)

H01L 21/00

IPC 8 full level (invention and additional information)

H01L 21/00 (2006.01); H01L 21/683 (2006.01)

CPC (invention and additional information)

H01L 21/67132 (2013.01); H01L 21/67092 (2013.01); H01L 21/6838 (2013.01)

Citation (search report)

See references of WO 0227764A1

Designated contracting state (EPC)

AT BE CH CY DE FR GB IT LI

EPO simple patent family

DE 10048881 A1 20020307; EP 1320873 A1 20030625; US 2003173017 A1 20030918; US 2006032587 A1 20060216; US 6972069 B2 20051206; WO 0227764 A1 20020404

INPADOC legal status


2009-04-22 [18D] APPLICATION DEEMED TO BE WITHDRAWN

- Effective date: 20081222

2006-11-08 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20061006

2004-05-19 [RBV] DESIGNATED CONTRACTING STATES (CORRECTION)

- Designated State(s): AT BE CH CY DE FR GB IT LI

2003-06-25 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20030307

2003-06-25 [AK] DESIGNATED CONTRACTING STATES:

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR