Global Patent Index - EP 1320880 A2

EP 1320880 A2 2003-06-25 - SINGULATION OF SEMICONDUCTOR PACKAGES BY TIE BAR CUTTING

Title (en)

SINGULATION OF SEMICONDUCTOR PACKAGES BY TIE BAR CUTTING

Title (de)

SINGULIERUNG VON HALBLEITERCHIPS DURCH TRAVERSENSCHNEIDEN

Title (fr)

SEPARATION DE BOITIERS SEMI-CONDUCTEURS PAR DECOUPE AU MOYEN D'UNE COLONNE-GUIDE

Publication

EP 1320880 A2 (EN)

Application

EP 01985776 A

Priority

  • US 0129195 W
  • US 66958400 A

Abstract (en)

[origin: WO0227779A2] An apparatus for separating a chip package from a carrier, in accordance with the present invention, includes a separation tool having a planar surface for supporting a chip package. The planar surface includes opposite ends, and first cutting edges are disposed on the opposite ends of the planar surface. A cutting plate has second cutting edges, and the cutting plate is operatively positioned for causing a shearing action between the first and second cutting edges to sever connections to the chip package when the first and second cutting edges engage to remove the chip package from the carrier.

IPC 1-7 (main, further and additional classification)

H01L 21/48

IPC 8 full level (invention and additional information)

H01L 23/50 (2006.01); H01L 21/00 (2006.01); H01L 21/48 (2006.01)

CPC (invention and additional information)

H01L 21/67092 (2013.01); H01L 21/4842 (2013.01)

Citation (search report)

See references of WO 0227779A3

Designated contracting state (EPC)

AT BE CH CY DE FR GB IE IT LI

EPO simple patent family

WO 0227779 A2 20020404; WO 0227779 A3 20020711; EP 1320880 A2 20030625; JP 2004510349 A 20040402; KR 20030069996 A 20030827

INPADOC legal status


2006-02-01 [18W] APPLICATION WITHDRAWN

- Effective date: 20051207

2004-05-19 [RBV] DESIGNATED CONTRACTING STATES (CORRECTION)

- Designated State(s): AT BE CH CY DE FR GB IE IT LI

2003-07-30 [RIN1] INVENTOR CHANGED BEFORE GRANT

- Inventor name: KOCH, RONALD

2003-07-30 [RIN1] INVENTOR CHANGED BEFORE GRANT

- Inventor name: BLUMENAUER, MICHAEL

2003-07-30 [RIN1] INVENTOR CHANGED BEFORE GRANT

- Inventor name: POOLE, DAVID

2003-07-30 [RIN1] INVENTOR CHANGED BEFORE GRANT

- Inventor name: HETZEL, WOLFGANG

2003-06-25 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20030320

2003-06-25 [AK] DESIGNATED CONTRACTING STATES:

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE