EP 1320880 A2 20030625 - SINGULATION OF SEMICONDUCTOR PACKAGES BY TIE BAR CUTTING
Title (en)
SINGULATION OF SEMICONDUCTOR PACKAGES BY TIE BAR CUTTING
Title (de)
SINGULIERUNG VON HALBLEITERCHIPS DURCH TRAVERSENSCHNEIDEN
Title (fr)
SEPARATION DE BOITIERS SEMI-CONDUCTEURS PAR DECOUPE AU MOYEN D'UNE COLONNE-GUIDE
Publication
Application
Priority
- US 0129195 W 20010919
- US 66958400 A 20000926
Abstract (en)
[origin: WO0227779A2] An apparatus for separating a chip package from a carrier, in accordance with the present invention, includes a separation tool having a planar surface for supporting a chip package. The planar surface includes opposite ends, and first cutting edges are disposed on the opposite ends of the planar surface. A cutting plate has second cutting edges, and the cutting plate is operatively positioned for causing a shearing action between the first and second cutting edges to sever connections to the chip package when the first and second cutting edges engage to remove the chip package from the carrier.
IPC 1-7
IPC 8 full level
H01L 21/00 (2006.01); H01L 21/48 (2006.01); H01L 23/50 (2006.01)
CPC (source: EP KR)
H01L 21/4842 (2013.01 - EP); H01L 21/67092 (2013.01 - EP); H01L 21/78 (2013.01 - KR)
Citation (search report)
See references of WO 0227779A2
Designated contracting state (EPC)
AT BE CH CY DE FR GB IE IT LI
DOCDB simple family (publication)
WO 0227779 A2 20020404; WO 0227779 A3 20020711; EP 1320880 A2 20030625; JP 2004510349 A 20040402; KR 20030069996 A 20030827
DOCDB simple family (application)
US 0129195 W 20010919; EP 01985776 A 20010919; JP 2002531476 A 20010919; KR 20037004390 A 20030326