Global Patent Index - EP 1320888 A2

EP 1320888 A2 2003-06-25 - STRUCTURE AND PROCESS FOR REDUCING DIE CORNER AND EDGE STRESSES IN MICROELECTRONIC PACKAGES

Title (en)

STRUCTURE AND PROCESS FOR REDUCING DIE CORNER AND EDGE STRESSES IN MICROELECTRONIC PACKAGES

Title (de)

STRUKTUR UND PROZESS ZUR REDUZIERUNG VON THERMISCH INDUZIERTEN SPANNUNGEN IN MIKROELEKTRONISCHEN PACKUNGEN

Title (fr)

STRUCTURE ET PROC D POUR R DUIRE LES CONTRAINTES AUX BORDS ET AUX COINS DES MICROPLAQUETTES DANS LES BO TIERS MICRO LECTRONIQUES

Publication

EP 1320888 A2 (EN)

Application

EP 01977196 A

Priority

  • US 0130157 W
  • US 67511200 A

Abstract (en)

[origin: WO0227788A2] A microelectronic die is aligned with a package substrate and attached to it using solder balls. A specially shaped heat spreader, preferably with a coefficient of thermal expansion (CTE) similar to that of silicon, is attached to the back side of the die using a heat-conducting adhesive. An epoxy-based material is flowed into the gap between the die, the substrate, and the heat spreader via a through-hole in either the substrate or the heat spreader using a dispense process or a transfer molding process. By positioning the heat spreader to abut the die corners and/or edges, the stresses on the die are substantially reduced or eliminated.

IPC 1-7 (main, further and additional classification)

H01L 23/367

IPC 8 full level (invention and additional information)

H01L 23/36 (2006.01); H01L 23/367 (2006.01)

CPC (invention and additional information)

H01L 23/36 (2013.01); H01L 23/3677 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/16151 (2013.01)

Combination set (CPC)

  1. H01L 2924/10253 + H01L 2924/00
  2. H01L 2924/00014 + H01L 2224/0401

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

EPO simple patent family

WO 0227788 A2 20020404; WO 0227788 A3 20020613; AU 9633201 A 20020408; CN 1309064 C 20070404; CN 1476634 A 20040218; EP 1320888 A2 20030625; MY 126122 A 20060929; TW I278046 B 20070401; US 2004087061 A1 20040506; US 6617682 B1 20030909; US 6794223 B2 20040921

INPADOC legal status


2011-05-13 [REG HK WD] APPLICATIONS WITHDRAWN, DEEMED TO BE WITHDRAWN, OR REFUSED AFTER PUBLICATION IN HONG KONG

- Document: HK 1053745

2011-03-23 [18R] REFUSED

- Effective date: 20101113

2003-06-25 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20030416

2003-06-25 [AK] DESIGNATED CONTRACTING STATES:

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

2003-06-25 [AX] REQUEST FOR EXTENSION OF THE EUROPEAN PATENT TO

- Countries: AL LT LV MK RO SI