Global Patent Index - EP 1320889 A1

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EP 1320889 A1 20030625 - CONNECTING DEVICE

Title (en)

CONNECTING DEVICE

Title (de)

VERBINDUNGSEINRICHTUNG

Title (fr)

DISPOSITIF DE CONNEXION

Publication

EP 1320889 A1 20030625 (DE)

Application

EP 01971698 A 20010910

Priority

DE 0103439 W 20010910
DE 10048426 A 20000929
DE 10124141 A 20010517

Abstract (en)

[origin: WO0227789A1] The aim of the invention is to take up the smallest amount of space possible while effecting the thermomechanical release in tension at the junction between a circuit unit (2) and contact device (4) of a circuit (1), said junction being provided by means of the connecting device (10). To this end, the connecting device (10) is essentially provided as a prefabricated metallic or alloy region in the area of the circuit unit (2) and in the area of the contact device (4) while avoiding, to the greatest possible extent, the use of adhesive elements and solder elements.

IPC 1-7

H01L 23/482; H01L 23/495

IPC 8 full level

H01L 23/482 (2006.01); H01L 23/495 (2006.01)

CPC (source: EP)

H01L 23/49513 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83825 (2013.01); H01L 2224/85399 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01052 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/181 (2013.01)

Citation (search report)

See references of WO 0227789A1

Designated contracting state (EPC)

FR GB IT

DOCDB simple family (publication)

WO 0227789 A1 20020404; WO 0227789 B1 20020725; EP 1320889 A1 20030625

DOCDB simple family (application)

DE 0103439 W 20010910; EP 01971698 A 20010910