Global Patent Index - EP 1320889 A1

EP 1320889 A1 2003-06-25 - CONNECTING DEVICE

Title (en)

CONNECTING DEVICE

Title (de)

VERBINDUNGSEINRICHTUNG

Title (fr)

DISPOSITIF DE CONNEXION

Publication

EP 1320889 A1 (DE)

Application

EP 01971698 A

Priority

  • DE 0103439 W
  • DE 10048426 A
  • DE 10124141 A

Abstract (en)

[origin: WO0227789A1] The aim of the invention is to take up the smallest amount of space possible while effecting the thermomechanical release in tension at the junction between a circuit unit (2) and contact device (4) of a circuit (1), said junction being provided by means of the connecting device (10). To this end, the connecting device (10) is essentially provided as a prefabricated metallic or alloy region in the area of the circuit unit (2) and in the area of the contact device (4) while avoiding, to the greatest possible extent, the use of adhesive elements and solder elements.

IPC 1-7 (main, further and additional classification)

H01L 23/482; H01L 23/495

IPC 8 full level (invention and additional information)

H01L 23/482 (2006.01); H01L 23/495 (2006.01)

CPC (invention and additional information)

H01L 24/48 (2013.01); H01L 23/49513 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83825 (2013.01); H01L 2224/85399 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01052 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/181 (2013.01)

Combination set (CPC)

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2224/48091 + H01L 2924/00014
  3. H01L 2224/85399 + H01L 2924/00014
  4. H01L 2224/73265 + H01L 2224/32245 + H01L 2224/48247 + H01L 2924/00012
  5. H01L 2924/0132 + H01L 2924/0105 + H01L 2924/01079
  6. H01L 2924/01322 + H01L 2924/0105 + H01L 2924/01079
  7. H01L 2924/00014 + H01L 2224/45099 + H01L 2924/01079
  8. H01L 2924/00014 + H01L 2224/05599
  9. H01L 2224/92247 + H01L 2224/73265 + H01L 2224/32245 + H01L 2224/48247 + H01L 2924/00
  10. H01L 2224/04042 + H01L 2924/00
  11. H01L 2924/00014 + H01L 2224/45099
  12. H01L 2924/00014 + H01L 2224/05556
  13. H01L 2924/181 + H01L 2924/00012

Citation (search report)

See references of WO 0227789A1

Designated contracting state (EPC)

FR GB IT

EPO simple patent family

WO 0227789 A1 20020404; WO 0227789 B1 20020725; EP 1320889 A1 20030625

INPADOC legal status


2011-12-21 [18D] APPLICATION DEEMED TO BE WITHDRAWN

- Effective date: 20110629

2011-03-23 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20110218

2010-06-02 [RAP1] TRANSFER OF RIGHTS OF AN APPLICATION

- Owner name: INFINEON TECHNOLOGIES AG

2004-06-17 [REG DE 8566] DESIGNATED COUNTRY DE NOT LONGER VALID

2004-05-12 [RBV] DESIGNATED CONTRACTING STATES (CORRECTION)

- Designated State(s): FR GB IT

2003-06-25 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20030320

2003-06-25 [AK] DESIGNATED CONTRACTING STATES:

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR