EP 1325331 A1 20030709 - COMPOSITIONS AND METHODS FOR SEPARATION OF MOIETIES ON CHIPS
Title (en)
COMPOSITIONS AND METHODS FOR SEPARATION OF MOIETIES ON CHIPS
Title (de)
ZUSAMMENSETZUNGEN UND VERFAHREN ZUR TRENNUNG VON WIRKSAMEN ANTEILEN AUF CHIPS
Title (fr)
COMPOSITIONS ET PROCEDES DE SEPARATION DE FRACTIONS SUR DES PUCES
Publication
Application
Priority
- CN 00131649 A 20001009
- US 0130891 W 20011002
- US 68673700 A 20001010
Abstract (en)
[origin: WO0231506A1] The present invention recognizes that separation of components of a sample facilitate, and are often necessary for, sample analysis. Dielectrophoretic separation provides an efficient, reliable, nondisruptive, and automatable method for the separation of moieties in a sample based on their dielectric properties. The present invention provides compositions and methods for enhancing the dielectrophoretic separation of one or more moieties in a sample.
IPC 1-7
IPC 8 full level
B03C 5/02 (2006.01); G01N 33/569 (2006.01)
CPC (source: EP)
B03C 5/028 (2013.01); G01N 33/56972 (2013.01); B01J 2219/00585 (2013.01); B01J 2219/00596 (2013.01); B01J 2219/00605 (2013.01); B01J 2219/00612 (2013.01); B01J 2219/00626 (2013.01); B01J 2219/00653 (2013.01); B01J 2219/00659 (2013.01); B01J 2219/00702 (2013.01)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0231506 A1 20020418; AU 9651601 A 20020422; CA 2424996 A1 20020418; EP 1325331 A1 20030709; EP 1325331 A4 20070509
DOCDB simple family (application)
US 0130891 W 20011002; AU 9651601 A 20011002; CA 2424996 A 20011002; EP 01977391 A 20011002