EP 1325384 A2 20030709 - HIGH-DENSITY WIRE BOND MICRODISPLAY
Title (en)
HIGH-DENSITY WIRE BOND MICRODISPLAY
Title (de)
MIKROANZEIGE MIT DRAHTANSCHLÜSSEN HOHER DICHTE
Title (fr)
MICROECRAN A HAUTE DENSITE DE CONNEXIONS PAR FILS
Publication
Application
Priority
- US 0130579 W 20011001
- US 67848900 A 20001003
Abstract (en)
[origin: WO0229480A2] A microdisplay system havng an improved packaging that is particularly useful in a high-density wire bonding system is herein provided. A frame structure helps support a flexible printed circuit having an extended portion. The extended permits standard-sized via placement using conventional drilling processes. The extended portion may be folded and creased out of the way and adhered to the underside of the display system. An increased number of traces is provided in a given area while maintaining the space and trace width requirements for cost effective manufacturing.
IPC 1-7
IPC 8 full level
G02F 1/13 (2006.01)
CPC (source: EP)
G02F 1/13452 (2013.01); G02F 1/133308 (2013.01)
Citation (search report)
See references of WO 0229480A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0229480 A2 20020411; WO 0229480 A3 20021128; AU 9490801 A 20020415; EP 1325384 A2 20030709
DOCDB simple family (application)
US 0130579 W 20011001; AU 9490801 A 20011001; EP 01975597 A 20011001