EP 1327258 A1 20030716 - CHEMICAL-MECHANICAL POLISHING SLURRY AND METHOD
Title (en)
CHEMICAL-MECHANICAL POLISHING SLURRY AND METHOD
Title (de)
CHEMISCH-MECHANISCHE POLIERAUFSCHLÄMMUNG UND VERFAHREN
Title (fr)
BOUE DE POLISSAGE CHIMICO-MECANIQUE ET PROCEDE
Publication
Application
Priority
- US 0131432 W 20011009
- US 69273000 A 20001019
Abstract (en)
[origin: WO0233736A1] The present invention provides a chemical-mechanical polishing slurry for use in removing a barrier layer during the fabrication of a damascene structure. Tslurry according to the invention includes an agent that suppresses the rate at which an underlying silicon-containing dielectric layer is removed. In the presently most preferred embodiment of the invention, the agent that suppresses the rate at which an underlying silicon-containing dielectric layer is removed is L-lysine and/or L-arginine. The present invention also provides a method of suppressing the removal rate of an underlying silicon-containing dielectric layer during the chemical-mechanical polishing of a barrier layer in a damascene structure. The method according to the invention includes polishing the barrier layer with a slurry comprising an agent that suppresses the rate at which said underlying silicon-containing dielectric layer is removed.
IPC 1-7
IPC 8 full level
B24B 37/00 (2006.01); C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/304 (2006.01); H01L 21/321 (2006.01)
CPC (source: EP KR US)
C09G 1/02 (2013.01 - EP KR US); H01L 21/3212 (2013.01 - KR)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0233736 A1 20020425; AU 9671301 A 20020429; CN 100401459 C 20080709; CN 1633698 A 20050629; EP 1327258 A1 20030716; EP 1327258 A4 20050914; JP 2004512681 A 20040422; KR 100718573 B1 20070515; KR 20030034255 A 20030501; US 2004157454 A1 20040812; US 6702954 B1 20040309; US 7101800 B2 20060905
DOCDB simple family (application)
US 0131432 W 20011009; AU 9671301 A 20011009; CN 01817652 A 20011009; EP 01977607 A 20011009; JP 2002537038 A 20011009; KR 20037004967 A 20030408; US 69273000 A 20001019; US 74972603 A 20031230