EP 1328377 A1 20030723 - SEGMENTED WAFER POLISHING PAD
Title (en)
SEGMENTED WAFER POLISHING PAD
Title (de)
SEGMENTIERTES POLIERKISSEN ZUM POLIEREN VON HALBLEITERSCHEIBEN
Title (fr)
ELEMENT DE POLISSAGE DE TRANCHE SEGMENTEE
Publication
Application
Priority
- GB 0104654 W 20011019
- GB 0025745 A 20001020
Abstract (en)
[origin: WO0232624A1] Working plate (10) is formed of forty-eight sections (10'), with groove (12) extending through the majority of the thickness of the plate. In one form, dovetail grooves are machined to the back of the sections of the plates (10') attached to the base plate (19). In an alternative arrangement, fixing rails are attached to the backs of the sections and the dovetail grooves are in the base plate (19).
IPC 1-7
IPC 8 full level
B24B 37/26 (2012.01); B24D 7/06 (2006.01)
CPC (source: EP US)
B24B 37/26 (2013.01 - EP US); B24D 7/06 (2013.01 - EP US)
Citation (search report)
See references of WO 0232624A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0232624 A1 20020425; AU 9574901 A 20020429; EP 1328377 A1 20030723; GB 0025745 D0 20001206; US 2004029501 A1 20040212
DOCDB simple family (application)
GB 0104654 W 20011019; AU 9574901 A 20011019; EP 01976480 A 20011019; GB 0025745 A 20001020; US 39994903 A 20030801