Global Patent Index - EP 1330494 A1

EP 1330494 A1 20030730 - MOLDING MATERIALS EXHIBITING AN IMPROVED LOW-TEMPERATURE IMPACT RESISTANCE

Title (en)

MOLDING MATERIALS EXHIBITING AN IMPROVED LOW-TEMPERATURE IMPACT RESISTANCE

Title (de)

FORMMASSEN MIT VERBESSERTER KÄLTESCHLAGZÄHIGKEIT

Title (fr)

MATIERES DE MOULAGE A RESISTANCE AU FROID AMELIOREE

Publication

EP 1330494 A1 20030730 (DE)

Application

EP 01992741 A 20011022

Priority

  • DE 10054053 A 20001031
  • EP 0112173 W 20011022

Abstract (en)

[origin: WO0236683A1] The invention relates to a molding material, which is provided with impact resistance and which is characterized by exhibiting a particularly high impact resistance at low temperatures (-20 DEG C, -40 DEG C). This low-temperature impact resistance is achieved by using a silicon elastomer.

IPC 1-7

C08L 33/12; C08L 25/12; C08L 51/08

IPC 8 full level

C08F 265/04 (2006.01); C08F 285/00 (2006.01); C08L 25/12 (2006.01); C08L 33/08 (2006.01); C08L 33/12 (2006.01); C08L 51/00 (2006.01); C08L 51/08 (2006.01); C08L 55/02 (2006.01)

CPC (source: EP US)

C08F 265/04 (2013.01 - EP US); C08F 285/00 (2013.01 - EP US); C08L 25/12 (2013.01 - EP US); C08L 33/12 (2013.01 - EP US); C08L 51/003 (2013.01 - EP US); C08L 51/08 (2013.01 - EP US); C08L 55/02 (2013.01 - EP US); C08L 33/08 (2013.01 - EP US); C08L 51/085 (2013.01 - EP US)

C-Set (source: EP US)

  1. C08L 25/12 + C08L 2666/02
  2. C08L 33/12 + C08L 2666/02
  3. C08L 51/003 + C08L 2666/02
  4. C08L 51/003 + C08L 2666/04
  5. C08L 51/08 + C08L 2666/04
  6. C08L 51/08 + C08L 2666/02
  7. C08L 55/02 + C08L 2666/02
  8. C08L 55/02 + C08L 2666/04

Designated contracting state (EPC)

AT BE CH CY DE DK ES LI

DOCDB simple family (publication)

WO 0236683 A1 20020510; AU 2171402 A 20020515; CA 2427432 A1 20030430; DE 10054053 A1 20020529; EP 1330494 A1 20030730; JP 2004513203 A 20040430; US 2004039083 A1 20040226; US 6906142 B2 20050614

DOCDB simple family (application)

EP 0112173 W 20011022; AU 2171402 A 20011022; CA 2427432 A 20011022; DE 10054053 A 20001031; EP 01992741 A 20011022; JP 2002539433 A 20011022; US 41510003 A 20030430