Global Patent Index - EP 1331279 A3

EP 1331279 A3 20040102 - Method and apparatus for shaping semisolid metals

Title (en)

Method and apparatus for shaping semisolid metals

Title (de)

Verfahren und Vorrichtung zum Formen halbfester Metalle

Title (fr)

Procédé et dispositif pour mettre des métaux semi-solides en forme

Publication

EP 1331279 A3 20040102 (EN)

Application

EP 02028272 A 19960529

Priority

  • EP 96108499 A 19960529
  • JP 13013495 A 19950529
  • JP 16089095 A 19950627
  • JP 23650195 A 19950914
  • JP 24410995 A 19950922
  • JP 24411195 A 19950922
  • JP 24789795 A 19950926
  • JP 24948295 A 19950927
  • JP 25276295 A 19950929
  • JP 25276895 A 19950929
  • JP 25276995 A 19950929
  • JP 29076095 A 19951109
  • JP 32065095 A 19951208
  • JP 33295595 A 19951221
  • JP 8784896 A 19960410

Abstract (en)

[origin: EP0745694A1] The improved method and apparatus for the semisolid forming of alloys to enable shaped parts having a fine-grained, spherical thixotropic structures to be produced in a convenient, easy and inexpensive manner without relying upon the conventional mechanical or electromagnetic agitation. In the method, a liquid alloy having crystal nuclei at a temperature not lower than the liquidus temperature or a partially solid, partially liquid alloy having crystal nuclei at a temperature not lower than a molding temperature is fed into an insulated vessel having a heat insulating effect, held in said insulated vessel for a period from 5 seconds to 60 minutes as it is cooled to the molding temperature where a specified fraction liquid is established, thereby crystallizing fine primary crystals in the alloy solution, and the alloy is fed into a forming mold, where it is shaped under pressure.

IPC 1-7

C22C 1/00; B22D 17/00

IPC 8 full level

B22D 17/00 (2006.01); C22C 1/00 (2006.01)

CPC (source: EP)

B22D 17/007 (2013.01); C22C 1/12 (2023.01)

Citation (search report)

  • [A] EP 0392998 A1 19901017 - CROSTI GIOVANNI [IT], et al
  • [A] WO 9213662 A1 19920820 - TRANSVALOR SA [FR]
  • [A] PATENT ABSTRACTS OF JAPAN vol. 011, no. 078 (M - 570) 10 March 1987 (1987-03-10)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 017, no. 574 (M - 1498) 19 October 1993 (1993-10-19)

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

EP 0745694 A1 19961204; EP 0745694 B1 20041208; CA 2177455 A1 19961130; CA 2177455 C 20070703; EP 1331279 A2 20030730; EP 1331279 A3 20040102

DOCDB simple family (application)

EP 96108499 A 19960529; CA 2177455 A 19960527; EP 02028272 A 19960529