EP 1331281 A1 20030730 - Aluminum alloy for die casting, die casting method using same alloy, and die casting product by same method
Title (en)
Aluminum alloy for die casting, die casting method using same alloy, and die casting product by same method
Title (de)
Aluminiumlegierung zum Druckgiessen, Herstellungsverfahren durch Druckgiessen dieser Legierung, und durch dieses Verfahren hergestelltes druckgegossenes Produkt
Title (fr)
Alliage d'aluminium pour moulage sous pression, méthode de moulage sous pression avec cet alliage, et produit moulé sous pression obtenu par cette méthode
Publication
Application
Priority
JP 2002009839 A 20020118
Abstract (en)
An aluminum alloy for a die casting, used as the material of parts of an automotive vehicle. The aluminum alloy consists essentially of Si in an amount ranging from 10 to 12% by weight, Mg in an amount ranging from 0.15 to 0.50% by weight, Mn in an amount ranging from 0.5 to 1.0% by weight, Fe in an amount of not more than 0.15% by weight, Ti in an amount of not more than 0.1% by weight, Sb in an amount ranging from 0.05 to 0.20% by weight, B in an amount ranging from 0.005 to 0.02%, and balance consisting of aluminum and inevitable impurities. Sb in the amont ranging from 0,05 to 0,20% by weight could be replaced with Sr in an amount from 0,005 to 0,020% by weight. <IMAGE>
IPC 1-7
IPC 8 full level
B22D 17/00 (2006.01); B22D 17/14 (2006.01); C22C 21/02 (2006.01); C22C 21/04 (2006.01); C22F 1/00 (2006.01); C22F 1/043 (2006.01)
CPC (source: EP US)
B22D 17/14 (2013.01 - EP US); C22C 21/04 (2013.01 - EP US)
Citation (search report)
- [AD] EP 0687742 A1 19951220 - RHEINFELDEN ALUMINIUM GMBH [DE]
- [A] PATENT ABSTRACTS OF JAPAN vol. 1999, no. 04 30 April 1999 (1999-04-30)
- [A] PATENT ABSTRACTS OF JAPAN vol. 1997, no. 09 30 September 1997 (1997-09-30)
- [A] PATENT ABSTRACTS OF JAPAN vol. 017, no. 648 (M - 1518) 2 December 1993 (1993-12-02)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1331281 A1 20030730; EP 1331281 B1 20050518; DE 60300659 D1 20050623; DE 60300659 T2 20051117; JP 2003213354 A 20030730; JP 4007488 B2 20071114; US 2003136477 A1 20030724
DOCDB simple family (application)
EP 03000610 A 20030114; DE 60300659 T 20030114; JP 2002009839 A 20020118; US 33674003 A 20030106