EP 1336196 A2 20030820 - DEVICE AND METHOD FOR ENCASING AN ELECTRONIC COMPONENT
Title (en)
DEVICE AND METHOD FOR ENCASING AN ELECTRONIC COMPONENT
Title (de)
VORRICHTUNG UND VERFAHREN ZUR UMHÜLLUNG EINES ELEKTRONISCHEN BAUELEMENTS
Title (fr)
DISPOSITIF ET PROCEDE PERMETTANT D'ENVELOPPER UN COMPOSANT ELECTRONIQUE
Publication
Application
Priority
- DE 0103881 W 20011010
- DE 10055247 A 20001108
Abstract (en)
[origin: WO0239487A2] The invention relates to a device (1) and to a method for encasing an electronic component (10). According to the invention, the device (1) comprises a sleeve (100) and a casting compound (200), whereby said casting compound (200) is hardened. The casting compound (200) is one that hardens at an accelerated rate when exposed to water molecules, and the sleeve (100) provides the water molecules.
IPC 1-7
IPC 8 full level
C08J 3/24 (2006.01); H01L 23/24 (2006.01)
CPC (source: EP)
C08J 3/24 (2013.01); H01L 23/24 (2013.01); H01L 24/00 (2013.01); C08J 2363/00 (2013.01); H01L 2924/14 (2013.01)
C-Set (source: EP)
Citation (search report)
See references of WO 0239487A2
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 0239487 A2 20020516; WO 0239487 A3 20021128; DE 10055247 A1 20020516; EP 1336196 A2 20030820
DOCDB simple family (application)
DE 0103881 W 20011010; DE 10055247 A 20001108; EP 01993942 A 20011010