Global Patent Index - EP 1337589 A2

EP 1337589 A2 20030827 - MOLDABLE SILICONE ELASTOMERS HAVING SELECTIVE PRIMERLESS ADHESION

Title (en)

MOLDABLE SILICONE ELASTOMERS HAVING SELECTIVE PRIMERLESS ADHESION

Title (de)

FORMBARE SILIKONELASTOMERE MIT SELEKTIVER ADHÄSION OHNE PRIMER

Title (fr)

ELASTOMERES DE SILICONE MOULABLES PRESENTANT UNE ADHESIVITE SELECTIVE SANS PRIMAIRE

Publication

EP 1337589 A2 20030827 (EN)

Application

EP 01989788 A 20011119

Priority

  • US 0144668 W 20011119
  • US 71596300 A 20001117
  • US 99747301 A 20011119

Abstract (en)

[origin: WO0240592A2] Organopolysiloxane compositions that cure by the addition reaction of silicon-bonded lower alkenyl radicals with silicon-bonded hydrogen atoms and which exhibit select adhesion to a variety of substrates. The compositions comprise an adhesion promoting mixture comprising an epoxy-functional compound, soluble polydiorganosiloxanes, polycycloorganosiloxanes (linear and cyclic) and hydroxy end blocked hydrocarbons (glycols) thus giving release characteristics to metal substrates while maintaining adhesion to a thermoplastic substrate. Additionally, an additive may be used to produce surface lubricity after curing.

IPC 1-7

C08L 83/04

IPC 8 full level

C08J 5/04 (2006.01); C08L 83/04 (2006.01); C08L 83/06 (2006.01)

CPC (source: EP)

C08L 83/04 (2013.01); C08G 77/12 (2013.01); C08G 77/16 (2013.01); C08G 77/18 (2013.01); C08G 77/20 (2013.01); C08G 77/70 (2013.01)

Citation (search report)

See references of WO 0240592A2

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 0240592 A2 20020523; WO 0240592 A3 20021003; WO 0240592 A8 20021121; EP 1337589 A2 20030827

DOCDB simple family (application)

US 0144668 W 20011119; EP 01989788 A 20011119