EP 1338028 A1 20030827 - WAFER PROCESSING SYSTEM INCLUDING A ROBOT
Title (en)
WAFER PROCESSING SYSTEM INCLUDING A ROBOT
Title (de)
WAFERBEARBEITUNGSSYSTEM MIT EINEM ROBOTER
Title (fr)
SYSTEME DE TRAITEMENT DE PLAQUETTES COMPRENANT UN ROBOT
Publication
Application
Priority
US 0032655 W 20001201
Abstract (en)
[origin: WO03012830A1] A wafer processing system occupies minimal floor space by using vertically mounted modules such as reactors, load locks, and cooling stations. Further saving in floor space is achieved by using a loading station which employs rotational motion to move a wafer carrier into a load lock. The wafer processing system includes a robot having extension, rotational, and vertical motion for accessing vertically mounted modules. The robot is internally cooled and has a heat resistant end-effector, making the robot compatible with high temperature semiconductor processing.
IPC 1-7
IPC 8 full level
B25J 9/06 (2006.01); B65G 49/07 (2006.01); H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 21/677 (2006.01)
CPC (source: EP)
H01L 21/67178 (2013.01); H01L 21/67201 (2013.01); H01L 21/67742 (2013.01); H01L 21/67766 (2013.01)
Citation (search report)
See references of WO 03012830A1
Designated contracting state (EPC)
DE FR GB IT NL
DOCDB simple family (publication)
WO 03012830 A1 20030213; EP 1338028 A1 20030827; JP 2004522321 A 20040722
DOCDB simple family (application)
US 0032655 W 20001201; EP 00982323 A 20001201; JP 2003517914 A 20001201