EP 1339541 A4 20050720 - MOLECULAR SIEVE CONTAINING STRUCTURE FOR ORGANOLEPTIC SCAVENGING
Title (en)
MOLECULAR SIEVE CONTAINING STRUCTURE FOR ORGANOLEPTIC SCAVENGING
Title (de)
MOLEKULARSIEB ENTHALTENDE STRUKTUR FÜR ORGANOLEPTISCHE REINIGUNG
Title (fr)
TAMIS MOLECULAIRE RENFERMANT UNE STRUCTURE DE PIEGEAGE ORGANOLEPTIQUE
Publication
Application
Priority
- US 0127770 W 20011015
- US 70672600 A 20001107
Abstract (en)
[origin: WO0238373A1] An organoleptic multilayer paperboard based packaging uses a molecular sieve powder to adsorb low molecular weight oxidation products formed during the extrusion coating process. Figure 1 shows a polyethylene layer (10), adjacent a paperboard layer (12), and a low density polyethylene layer that contains a molecular sieve powder (14).
IPC 1-7
IPC 8 full level
B32B 27/10 (2006.01); B32B 27/18 (2006.01); B32B 27/32 (2006.01); B32B 29/00 (2006.01); B65D 65/40 (2006.01)
CPC (source: EP KR)
B32B 5/16 (2013.01 - KR); B32B 27/10 (2013.01 - EP); B32B 27/18 (2013.01 - EP); B32B 27/32 (2013.01 - EP); B32B 29/00 (2013.01 - EP)
Citation (search report)
- [A] EP 0307229 A2 19890315 - TOHOKU KOGYO CO LTD [JP], et al
- [X] PATENT ABSTRACTS OF JAPAN vol. 1995, no. 09 31 October 1995 (1995-10-31)
- [A] PATENT ABSTRACTS OF JAPAN vol. 1995, no. 03 28 April 1995 (1995-04-28)
- See references of WO 0238373A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0238373 A1 20020516; CN 1473105 A 20040204; EP 1339541 A1 20030903; EP 1339541 A4 20050720; JP 2004512992 A 20040430; KR 20030051675 A 20030625; TW 577812 B 20040301
DOCDB simple family (application)
US 0127770 W 20011015; CN 01818266 A 20011015; EP 01977094 A 20011015; JP 2002540933 A 20011015; KR 20037004254 A 20030325; TW 90126961 A 20011030