EP 1340256 A2 20030903 - PACKAGED ELECTRONIC COMPONENT AND METHOD FOR PACKAGING AN ELECTRONIC COMPONENT
Title (en)
PACKAGED ELECTRONIC COMPONENT AND METHOD FOR PACKAGING AN ELECTRONIC COMPONENT
Title (de)
VERPACKTES ELEKTRONISCHES BAUELEMENT UND VERFAHREN ZUR VERPACKUNG EINES ELEKTRONISCHEN BAUELEMENTS
Title (fr)
COMPOSANT ELECTRONIQUE ENCAPSULE ET SON PROCEDE DE PRODUCTION
Publication
Application
Priority
- DE 0104394 W 20011121
- DE 10058593 A 20001125
Abstract (en)
[origin: WO0243142A2] The invention relates to a packaged electronic component and to a method for packaging an electronic component, according to which a chip (1) is fastened to the top surface of a die pad (2). Said die pad (2) and the chip (1) are enclosed by a plastic material (3). A gel (11, 12) is disposed on the top surface of the chip (1) and on the bottom surface of the die pad (2).
IPC 1-7
IPC 8 full level
H01L 23/29 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP KR US)
H01L 23/29 (2013.01 - KR); H01L 23/296 (2013.01 - EP US); H01L 23/3135 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/45099 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2224/8592 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
DE FR IT
DOCDB simple family (publication)
WO 0243142 A2 20020530; WO 0243142 A3 20021128; DE 10058593 A1 20020606; EP 1340256 A2 20030903; JP 2004515060 A 20040520; KR 20040014420 A 20040214; US 2004084784 A1 20040506
DOCDB simple family (application)
DE 0104394 W 20011121; DE 10058593 A 20001125; EP 01997846 A 20011121; JP 2002544779 A 20011121; KR 20037006988 A 20030524; US 43294303 A 20031222