EP 1344243 A1 20030917 - METHOD AND DEVICE FOR TREATING SEMICONDUCTOR SUBSTRATES
Title (en)
METHOD AND DEVICE FOR TREATING SEMICONDUCTOR SUBSTRATES
Title (de)
VERFAHREN UND VORRICHTUNG ZUR BEARBEITUNG VON HALBLEITERSUBSTRATEN
Title (fr)
PROCEDE ET DISPOSITIF POUR TRAITER DES SUBSTRATS SEMI-CONDUCTEURS
Publication
Application
Priority
- DE 10064943 A 20001223
- DE 10159702 A 20011205
- EP 0114832 W 20011215
Abstract (en)
[origin: WO02052617A1] The invention relates to a method and to a device for treating semiconductor substrates. In conventional systems, the especially uncoated semiconductor substrates are fed to a treatment device through a charging sluice (1), said charging sluice (1) adjoining a transfer chamber (2). A plurality of treatment chambers (3, 4, 5) can be charged with the semiconductor substrates to be treated from said transfer chamber by first evacuating the transfer chamber (2) and the treatment chamber (3) and then opening the connecting door (7) between the transfer chamber (2) and the treatment chamber (3). The aim of the invention is to improve this system. To this end, at least one of the treatment chambers (4) is operated at a low pressure or atmospheric pressure and the transfer chamber (2) is flooded with an inert gas before the connecting door (8) associated with the treatment chamber (4) is opened, while a predetermined pressure difference between the transfer chamber and the treatment chamber is maintained.
IPC 1-7
IPC 8 full level
C23C 16/44 (2006.01); C23C 16/54 (2006.01); H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 21/205 (2006.01)
CPC (source: EP US)
C23C 16/4408 (2013.01 - EP US); C23C 16/54 (2013.01 - EP US); H01L 21/67017 (2013.01 - EP US); H01L 21/6719 (2013.01 - EP US); H01L 21/67196 (2013.01 - EP US)
Citation (search report)
See references of WO 02052617A1
Designated contracting state (EPC)
DE FR GB NL
DOCDB simple family (publication)
WO 02052617 A1 20020704; WO 02052617 B1 20020906; EP 1344243 A1 20030917; JP 2004516678 A 20040603; US 2004058464 A1 20040325; US 6908838 B2 20050621
DOCDB simple family (application)
EP 0114832 W 20011215; EP 01994794 A 20011215; JP 2002553223 A 20011215; US 60150803 A 20030623