Global Patent Index - EP 1345470 A2

EP 1345470 A2 20030917 - Method for manufacturing a body-worn electronic device adapted to the shape of an individual's body area

Title (en)

Method for manufacturing a body-worn electronic device adapted to the shape of an individual's body area

Title (de)

Verfahren zur Herstellung eines am Körper zu tragenden elektronischen Gerätes, welches an den Form eines Körperteils eines Individuum angepasst ist.

Title (fr)

Procédé de fabrication d'un dispositif électronique portable, adapté à la forme d'une partie du corps d'un individu

Publication

EP 1345470 A2 20030917 (EN)

Application

EP 03007673 A 20030403

Priority

EP 03007673 A 20030403

Abstract (en)

A body-worn device is manufactured by preparing a digitised three-dimensional representation (1) of an individual's body area whereat the body-worn device shall be applied. From such digitised three-dimensional representation there are automatically determined (20) characteristic features of the individual's area as digitised. In dependency from such determining (20), the digitised representation (1) is amended in a detailing step (22). The result is a digitised representation. This detailed digitised representation controls the shell manufacturing process (36) the resulting shell of which being assembled (38) to the body-worn device. <IMAGE>A body-worn device is manufactured by preparing a digitised three-dimensional representation (1) of an individual's body area whereat the body-worn device shall be applied. From such digitised three-dimensional representation there are automatically determined (20) characteristic features of the individual's area as digitised. In dependency from such determining (20), the digitised representation (1) is amended in a detailing step (22). The result is a digitised representation. This detailed digitised representation controls the shell manufacturing process (36) the resulting shell of which being assembled (38) to the body-worn device. <IMAGE>

IPC 1-7

H04R 25/00

IPC 8 full level

H04R 25/00 (2006.01)

CPC (source: EP US)

H04R 25/652 (2013.01 - EP US); H04R 25/658 (2013.01 - EP US)

Designated contracting state (EPC)

CH DE DK LI

DOCDB simple family (publication)

EP 1345470 A2 20030917; EP 1345470 A3 20031001; EP 1345470 B1 20061102; DE 60309363 D1 20061214; DE 60309363 T2 20070920; DK 1345470 T3 20070312

DOCDB simple family (application)

EP 03007673 A 20030403; DE 60309363 T 20030403; DK 03007673 T 20030403