EP 1346413 A2 20030924 - CIRCUIT
Title (en)
CIRCUIT
Title (de)
SCHALTUNGSANORDNUNG
Title (fr)
CIRCUIT
Publication
Application
Priority
- DE 0104589 W 20011206
- DE 10065747 A 20001229
Abstract (en)
[origin: WO02054492A2] The invention relates to a circuit comprising a first substrate (1) which has an integrated circuit (4) in a first surface (3) and a second surface (2) opposite the same, and a second substrate (9) which has a sensor (7) on one surface. Said second substrate (9) is adhesively connected to the first substrate (1) in such a way that the surface of the second substrate (9) comprising the sensor (7) faces one of the two surfaces (2, 3) of the first substrate (1). It can thus be determined whether the arrangement consisting of the first and second substrate is divided or has been divided.
[origin: WO02054492A2] According to the invention, a sensor arrangement is to be formed on a second substrate, said sensor arrangement being arranged opposite a surface of a first substrate. It can thus be determined whether the arrangement consisting of the first and second substrate is divided or has been divided.
IPC 1-7
IPC 8 full level
H01L 23/544 (2006.01); H01L 23/58 (2006.01); H01L 29/06 (2006.01)
CPC (source: EP)
H01L 23/544 (2013.01); H01L 23/57 (2013.01); H01L 24/31 (2013.01); H01L 29/0657 (2013.01); H01L 2223/54473 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01)
Citation (search report)
See references of WO 02054492A2
Designated contracting state (EPC)
AT BE CH CY DE FR GB IT LI
DOCDB simple family (publication)
WO 02054492 A2 20020711; WO 02054492 A3 20030213; DE 10065747 A1 20020711; EP 1346413 A2 20030924; TW 544897 B 20030801
DOCDB simple family (application)
DE 0104589 W 20011206; DE 10065747 A 20001229; EP 01995582 A 20011206; TW 90130634 A 20011211