EP 1346421 A1 20030924 - USE OF BORON AND ALUMINIUM COMPOUNDS IN ELECTRONIC COMPONENTS
Title (en)
USE OF BORON AND ALUMINIUM COMPOUNDS IN ELECTRONIC COMPONENTS
Title (de)
VERWENDUNG VON BOR- UND ALUMINIUM-VERBINDUNGEN IN ELEKTRONIK-BAUTEILEN
Title (fr)
UTILISATION DE COMPOSES DE BORE ET D'ALUMINIUM DANS DES COMPOSANTS ELECTRONIQUES
Publication
Application
Priority
- EP 01984879 A 20011220
- EP 0115176 W 20011220
- EP 00128296 A 20001222
Abstract (en)
[origin: EP1217668A1] The invention relates to the use of boron and aluminium compounds in the electronics sector, particularly as electronic transport material, as host material for the emission layer, as hole-blocking material respectively in phosphorescent-OLEDs, and layers produced therefrom by phosphorescent-OLEDs.
IPC 1-7
IPC 8 full level
G03G 5/06 (2006.01); C07F 5/02 (2006.01); C07F 5/06 (2006.01); C09K 11/06 (2006.01); H01L 51/30 (2006.01); H01L 51/50 (2006.01)
CPC (source: EP KR US)
C07F 5/02 (2013.01 - KR); H10K 50/11 (2023.02 - EP US); H10K 85/322 (2023.02 - US); H10K 85/324 (2023.02 - EP US); H10K 85/361 (2023.02 - EP US); H10K 85/658 (2023.02 - EP KR); H10K 85/615 (2023.02 - EP US); H10K 85/622 (2023.02 - EP US); H10K 85/654 (2023.02 - EP US); H10K 85/6565 (2023.02 - EP US); H10K 85/657 (2023.02 - EP US); H10K 85/6572 (2023.02 - EP US); Y10S 428/917 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB NL
DOCDB simple family (publication)
EP 1217668 A1 20020626; CN 100428522 C 20081022; CN 1554127 A 20041208; EP 1346421 A1 20030924; JP 2005501372 A 20050113; KR 100832765 B1 20080527; KR 20030077556 A 20031001; US 2004058194 A1 20040325; US 2006241321 A1 20061026; US 7060369 B2 20060613; US 7279603 B2 20071009; WO 02052661 A1 20020704
DOCDB simple family (application)
EP 00128296 A 20001222; CN 01821257 A 20011220; EP 0115176 W 20011220; EP 01984879 A 20011220; JP 2002553254 A 20011220; KR 20037008201 A 20030619; US 25059403 A 20031030; US 43685406 A 20060518