EP 1347078 A3 20040211 - Process for reducing the solubility of copper at the inner surface of a copper pipe
Title (en)
Process for reducing the solubility of copper at the inner surface of a copper pipe
Title (de)
Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs
Title (fr)
Procédé de réduction de la solubilité de cuivre à la surface intérieure d'un tuyau en cuivre
Publication
Application
Priority
DE 10213185 A 20020323
Abstract (en)
[origin: EP1347078A2] Inner surface of a copper pipe is sealed by a layer of tin coating, to prevent copper ions dispersing into drinking water flowing through it. The process parameters of the tin coating are set to give a consistent tin crystal growth during degreasing and pickling, adjusting the flow speed to at most 1 m/second, at a temperature of 50-80 degreesC in a working time of 1-10 minutes. The plane of the tin crystals is parallel to the plane of the copper crystals, and their directions are at right angles to each other.
IPC 1-7
IPC 8 full level
C23C 30/00 (2006.01); C23C 18/31 (2006.01)
CPC (source: EP US)
C23C 18/31 (2013.01 - EP US)
Citation (search report)
- [A] EP 0848084 A1 19980617 - SUMITOMO LIGHT METAL IND [JP]
- [A] EP 0915183 A1 19990512 - ATOTECH DEUTSCHLAND GMBH [DE], et al
- [A] PATENT ABSTRACTS OF JAPAN vol. 1999, no. 03 31 March 1999 (1999-03-31)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1347078 A2 20030924; EP 1347078 A3 20040211; AU 2003200591 A1 20031009; AU 2003200591 B2 20080731; CA 2419630 A1 20030923; DE 10213185 A1 20031002; JP 2004043960 A 20040212; MX PA03001950 A 20041029; US 2003178107 A1 20030925
DOCDB simple family (application)
EP 03005781 A 20030314; AU 2003200591 A 20030220; CA 2419630 A 20030221; DE 10213185 A 20020323; JP 2003077931 A 20030320; MX PA03001950 A 20030305; US 39190603 A 20030319