Global Patent Index - EP 1348320 A1

EP 1348320 A1 20031001 - METHOD FOR PRODUCING ELECTROCONDUCTIVE STRUCTURES

Title (en)

METHOD FOR PRODUCING ELECTROCONDUCTIVE STRUCTURES

Title (de)

VERFAHREN ZUM HERSTELLEN VON ELEKTRISCH LEITENDEN STRUKTUREN

Title (fr)

PROCEDE DE FABRICATION DE STRUCTURES ELECTROCONDUCTRICES

Publication

EP 1348320 A1 20031001 (DE)

Application

EP 02726979 A 20020103

Priority

  • CH 0200001 W 20020103
  • CH 0100004 W 20010104
  • CH 12322001 A 20010704

Abstract (en)

[origin: WO02054840A1] The invention relates to a method for producing electroconductive structures. An electrically isolating substrate (101) is produced or prepared in such a way that it comprises a surface having cavities at the sites where the electroconductive structures are to be formed. At least some of said cavities have a cross-section which is perpendicular to a surface of the substrate (101) and in which the aspect ratio (the ratio between the depth (t) and the width (b) of the structures) is between 1:5 and 5:1, for example at least 2:3. The surface of the substrate is provided with an electroconductive layer which is thin in comparison to the characteristic dimensions of the cavities. The surface of the substrate is then galvanised until said cavities are full.

IPC 1-7

H05K 3/10; C25D 3/38

IPC 8 full level

C25D 3/38 (2006.01); H05K 3/10 (2006.01); H05K 3/24 (2006.01); H05K 3/38 (2006.01); H05K 3/42 (2006.01)

CPC (source: EP)

C25D 3/38 (2013.01); H05K 3/107 (2013.01); H05K 3/108 (2013.01); H05K 3/38 (2013.01); H05K 3/423 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/0353 (2013.01); H05K 2203/0723 (2013.01)

Citation (search report)

See references of WO 02054840A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 02054840 A1 20020711; EP 1348320 A1 20031001; JP 2005501394 A 20050113

DOCDB simple family (application)

CH 0200001 W 20020103; EP 02726979 A 20020103; JP 2002555595 A 20020103