EP 1351315 A3 20050817 - Electronic microcomponent integrating a capacitor structure and corresponding fabrication method

Title (en)

Electronic microcomponent integrating a capacitor structure and corresponding fabrication method

Title (de)

Elektronische Mikrokomponente mit integrierter Kondensator-Struktur und diesbezügliches Herstellungsverfahren

Title (fr)

Micro-composant électronique intégrant une structure capacitive, et procédé de fabrication

Publication

EP 1351315 A3 20050817 (FR)

Application

EP 03100542 A 20030305

Priority

FR 0203442 A 20020320
FR 0203445 A 20020320

Abstract (en)

[origin: US2003179521A1] Electronic microcomponent based on a substrate and incorporating a capacitive structure produced on top of a metallization level present in the substrate, said capacitive structure comprising two electrodes, wherein: the first electrode comprises a plurality of metal lamellae stacked on top of one another and separated from one another by narrower sections produced from the same metal; and the second electrode overlaps the first electrode, by comprising a plurality of lamellae interleaved between the lamellae of the first electrode.

IPC 1-7

H01L 29/92; H01L 21/02

IPC 8 full level

H01G 4/33 (2006.01); C23C 16/40 (2006.01); H01L 21/28 (2006.01); H01L 21/316 (2006.01); H01L 21/822 (2006.01); H01L 27/04 (2006.01); H01L 29/51 (2006.01); H10B 12/00 (2023.01); C23C 16/44 (2006.01)

CPC (source: EP US)

C23C 16/40 (2013.01 - EP US); H01L 21/02263 (2013.01 - EP); H01L 21/28167 (2013.01 - EP US); H01L 21/31604 (2013.01 - US); H01L 28/87 (2013.01 - EP US); H01L 29/511 (2013.01 - EP US)

Citation (search report)

[XAY] US 6078493 A 20000620 - KANG CHANG-SEOK [KR]
[X] EP 0814498 A1 19971229 - TEXAS INSTRUMENTS INC [US]
[X] US 5240871 A 19930831 - DOAN TRUNG T [US], et al
[DY] FR 2801425 A1 20010525 - ST MICROELECTRONICS SA [FR]
[A] WO 0046844 A1 20000810 - CONEXANT SYSTEMS INC [US]

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

US 2003179521 A1 20030925; CA 2421110 A1 20030920; EP 1351315 A2 20031008; EP 1351315 A3 20050817; JP 2003303896 A 20031024

DOCDB simple family (application)

US 37975403 A 20030305; CA 2421110 A 20030312; EP 03100542 A 20030305; JP 2003076543 A 20030319