EP 1352105 A2 20031015 - PHOTOCATALYTIC SPUTTERING TARGETS AND METHODS FOR THE PRODUCTION AND USE THEREOF
Title (en)
PHOTOCATALYTIC SPUTTERING TARGETS AND METHODS FOR THE PRODUCTION AND USE THEREOF
Title (de)
TARGETS FÜR DAS PHOTOKATALYTISCHE SPUTTERN UND VERFAHREN ZUR HERSTELLUNG UND VERWENDUNG DAVON
Title (fr)
CIBLES DE PULVERISATION PHOTOCATALYTIQUES ET PROCEDES DE PRODUCTION ET D'UTILISATION DE CES CIBLES
Publication
Application
Priority
- EP 0200378 W 20020114
- US 26287801 P 20010117
Abstract (en)
[origin: WO02057508A2] The invention provides sputtering targets that are adapted for the deposition of photocatalytic coatings. The invention also provides methods for producing sputtering targets of this nature. The methods comprise forming sputtering targets from photocatalyst particles that are free of inert particle treatment. The photocatalyst particles are plasma sprayed onto the target base. For example, a preferred embodiment of the invention comprises plasma spraying uncoated titanium dioxide particles onto a target base. The titanium dioxide particles are optionally plasma sprayed under conditions that result in the target base being coated with substoichiometric titanium oxide, TiOx, where x is less than 2. The invention also provides substrates coated by the disclosed sputtering methods.
[origin: WO02057508A2] The invention comprises forming sputtering targets from photocatalyst particles that are free of inert particle treatment. The photocatalyst particles are plasma sprayed onto the target base. For example, a preferred embodiment of the invention comprises plasma spraying uncoated titanium dioxide particles onto a target base. The titanium dioxide particles are optionally plasma sprayed under conditions that result in the target base being coated with substoichiometric titanium oxide, TiOx, where x is less than 2.
IPC 1-7
IPC 8 full level
B01J 35/02 (2006.01); C23C 14/34 (2006.01)
CPC (source: EP)
C23C 14/3414 (2013.01); H01J 37/3426 (2013.01); H01J 37/3491 (2013.01)
Citation (search report)
See references of WO 02057508A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02057508 A2 20020725; WO 02057508 A3 20030103; AU 2002250831 A1 20020730; EP 1352105 A2 20031015; JP 2004520484 A 20040708
DOCDB simple family (application)
EP 0200378 W 20020114; AU 2002250831 A 20020114; EP 02719697 A 20020114; JP 2002558558 A 20020114