EP 1352415 A2 20031015 - MONITORING SUBSTRATE PROCESSING USING REFLECTED RADIATION
Title (en)
MONITORING SUBSTRATE PROCESSING USING REFLECTED RADIATION
Title (de)
KONTROLLE DER SUBSTRATBEARBEITUNG MITTELS REFLEKTIERTER STRAHLUNG
Title (fr)
SURVEILLANCE DU TRAITEMENT DE SUBSTRATS PAR LE RAYONNEMENT REFLECHI
Publication
Application
Priority
- US 0149437 W 20011023
- US 69557700 A 20001023
- US 80308001 A 20010308
Abstract (en)
[origin: WO0235586A2] A substrate processing apparatus has a chamber capable of processing a substrate, a radiation source to provide a radiation, a radiation polarizer adapted to polarize the radiation to one or more polarization angles that are selected in relation to an orientation of a feature being processed on the substrate, a radiation detector to detect radiation reflected from the substrate during processing and generate a signal, and a controller to process the signal.
IPC 1-7
IPC 8 full level
G01N 21/15 (2006.01); H01L 21/3065 (2006.01); G01B 11/06 (2006.01); G01N 21/21 (2006.01); G01N 21/71 (2006.01); G01N 21/95 (2006.01); G01N 21/956 (2006.01); H01J 37/32 (2006.01); H01L 21/311 (2006.01); H01L 21/66 (2006.01); H01L 21/316 (2006.01)
CPC (source: EP US)
G01N 21/21 (2013.01 - EP US); G01N 21/9501 (2013.01 - EP); G01N 21/956 (2013.01 - EP); H01J 37/32935 (2013.01 - EP); H01L 21/31116 (2013.01 - EP); H01L 21/02126 (2013.01 - EP)
Citation (search report)
See references of WO 0235586A2
Designated contracting state (EPC)
DE FR GB IT NL
DOCDB simple family (publication)
WO 0235586 A2 20020502; WO 0235586 A3 20030807; CN 100459027 C 20090204; CN 1636261 A 20050706; EP 1352415 A2 20031015; JP 2004518272 A 20040617; JP 2007294987 A 20071108; JP 2007329485 A 20071220; JP 4098621 B2 20080611; JP 4841507 B2 20111221; TW 510008 B 20021111
DOCDB simple family (application)
US 0149437 W 20011023; CN 01816362 A 20011023; EP 01988945 A 20011023; JP 2002538471 A 20011023; JP 2007159820 A 20070618; JP 2007159821 A 20070618; TW 90126215 A 20011023