EP 1354351 B1 20090415 - DIRECT BUILD-UP LAYER ON AN ENCAPSULATED DIE PACKAGE
Title (en)
DIRECT BUILD-UP LAYER ON AN ENCAPSULATED DIE PACKAGE
Title (de)
DIREKTAUFBAUSCHICHT AUF EINER VERKAPSELTEN CHIPVERPACKUNG
Title (fr)
COUCHE FORMEE DIRECTEMENT SUR UN BOITIER A PUCE ENCAPSULE
Publication
Application
Priority
- US 0125060 W 20010810
- US 64096100 A 20000816
Abstract (en)
[origin: WO0215266A3] A microelectronic package including a microelectronic die having an active surface and at least one side. An encapsulation material is disposed adjacent the microelectronic die side(s), wherein the encapsulation material includes at least one surface substantially planar to the microelectronic die active surface. A first dielectric material layer may be disposed on at least a portion of the microelectronic die active surface and the encapsulation material surface. At least one conductive trace is then disposed on the first dielectric material layer. The conductive trace(s) is in electrical contact with the microelectronic die active surface. At least one conductive trace extends adjacent the microelectronic die active surface and adjacent the encapsulation material surface.
IPC 8 full level
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 21/68 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP)
H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3114 (2013.01); H01L 23/4334 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16 (2013.01); H01L 2224/20 (2013.01); H01L 2224/211 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/351 (2013.01); H05K 1/185 (2013.01); H05K 3/4602 (2013.01)
C-Set (source: EP)
Citation (examination)
US 5048179 A 19910917 - SHINDO MASAHIRO [JP], et al
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0215266 A2 20020221; WO 0215266 A3 20030814; AT E429032 T1 20090515; AU 8325701 A 20020225; CN 100426492 C 20081015; CN 1535479 A 20041006; DE 60138416 D1 20090528; EP 1354351 A2 20031022; EP 1354351 B1 20090415; HK 1055844 A1 20040121; MY 141327 A 20100416
DOCDB simple family (application)
US 0125060 W 20010810; AT 01962043 T 20010810; AU 8325701 A 20010810; CN 01817394 A 20010810; DE 60138416 T 20010810; EP 01962043 A 20010810; HK 03108126 A 20031110; MY PI20013852 A 20010815