EP 1354355 A1 20031022 - PLANARIZERS FOR SPIN ETCH PLANARIZATION OF ELECTRONIC COMPONENTS AND METHODS OF USE THEREOF
Title (en)
PLANARIZERS FOR SPIN ETCH PLANARIZATION OF ELECTRONIC COMPONENTS AND METHODS OF USE THEREOF
Title (de)
PLANARISIERER ZUR SCHLEUDER ÄTZPLANARISIERUNG ELEKTRONISCHER BAUELEMENTE UND VERFAHREN ZU IHRER VERWENDUNG
Title (fr)
AGENTS DE PLANARISATION POUR PLANARISATION PAR GRAVURE CENTRIFUGE DE COMPOSANTS ELECTRONIQUES ET PROCEDES D'UTILISATION
Publication
Application
Priority
- US 0201861 W 20020122
- US 76843901 A 20010123
- US 84776601 A 20010501
Abstract (en)
[origin: WO02059966A1] An electronic component contemplated comprises a substrate layer (110), a dielectric layer (120) coupled to the substrate layer (110), a barrier layer (130) coupled to the dielectric layer (120), a conductive layer (140) coupled to the barrier layer (130), and a protective layer (150) coupled to the conductive layer (140). A method of making the electronic component comprises the steps of providing a substrate (110) coupling a dielectric layer (120) to the substrate (110), coupling a barrier layer (130) to the dielectric layer (120), coupling a conductive layer (140) to the barrier layer (130), and coupling a protective layer (150) to the conductive layer (140). A method of planarizing a conductive surface of the electronic component comprises the steps of introducing or coupling a protective layer (150) onto a conductive layer (140), dispersing the protective layer (150) across the conductive layer (140), curing the protective layer (150), introducing an etching solution onto the conductive layer (140), and etching the conductive surface to substantial planarity.
IPC 1-7
IPC 8 full level
H01L 21/3205 (2006.01); C23F 3/06 (2006.01); H01L 21/321 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); H01L 23/52 (2006.01); H01L 23/532 (2006.01)
CPC (source: EP)
C23F 3/06 (2013.01); H01L 21/32115 (2013.01); H01L 21/32134 (2013.01); H01L 21/7684 (2013.01); H01L 23/53233 (2013.01); H01L 23/53238 (2013.01); H01L 2924/0002 (2013.01)
Citation (search report)
See references of WO 02059966A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02059966 A1 20020801; WO 02059966 A8 20031016; AU 2002237917 A1 20020806; CN 1488170 A 20040407; EP 1354355 A1 20031022; JP 2004523898 A 20040805
DOCDB simple family (application)
US 0201861 W 20020122; AU 2002237917 A 20020122; CN 02803987 A 20020122; EP 02704222 A 20020122; JP 2002560195 A 20020122