Global Patent Index - EP 1356716 B1

EP 1356716 B1 20040915 - ELECTRICALLY-CONDUCTING FLOOR COVERING

Title (en)

ELECTRICALLY-CONDUCTING FLOOR COVERING

Title (de)

ELEKTRISCH LEITFÄHIGER BODENBELAG

Title (fr)

REVETEMENT DE SOL ELECTROCONDUCTEUR

Publication

EP 1356716 B1 20040915 (DE)

Application

EP 01273588 A 20011201

Priority

  • DE 10104488 A 20010131
  • EP 0114069 W 20011201

Abstract (en)

[origin: US2002102385A1] An electrically conductive floor covering made of first particles of a polymer material which are surrounded with electrically conductive second particles and compressed in the intermediate space between the top and bottom sides of the floor covering, with the floor covering having at least one cut surface and the electrically conductive second particles forming conductive paths which connect the upper side and the lower side of the floor covering in an electrically conductive way, in which the first particles comprise at least one granulated elastomer material and form a matrix, in which the second particles form electric conductive paths along the particle boundaries of the first particles.

IPC 1-7

H05F 3/02; B29C 70/88

IPC 8 full level

B29C 70/88 (2006.01); D06N 1/00 (2006.01); E04F 15/18 (2006.01); E04F 15/12 (2006.01); H05F 1/00 (2006.01); H05F 3/02 (2006.01)

CPC (source: EP KR US)

B29C 70/882 (2013.01 - EP US); B32B 3/10 (2013.01 - KR); E04F 15/12 (2013.01 - EP US); H05F 3/025 (2013.01 - EP US); Y10T 428/24331 (2015.01 - EP US); Y10T 428/25 (2015.01 - EP US)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

US 2002102385 A1 20020801; US 6695999 B2 20040224; AT E276640 T1 20041015; BR 0109584 A 20030128; CA 2404954 A1 20020930; CA 2404954 C 20070313; CN 1180664 C 20041215; CN 1419802 A 20030521; CZ 20023687 A3 20030212; DE 10104488 A1 20020814; DE 50103688 D1 20041021; EP 1356716 A1 20031029; EP 1356716 B1 20040915; ES 2225418 T3 20050316; HU 224652 B1 20051228; HU P0300088 A2 20030628; JP 2004518266 A 20040617; JP 3746765 B2 20060215; KR 100507922 B1 20050819; KR 20020082493 A 20021031; MX PA02009430 A 20030212; PL 356203 A1 20040614; PT 1356716 E 20050131; SK 16172002 A3 20030502; TR 200202244 T1 20030321; TW 558586 B 20031021; US 2004142163 A1 20040722; WO 02062110 A1 20020808; ZA 200207598 B 20041220

DOCDB simple family (application)

US 5267502 A 20020117; AT 01273588 T 20011201; BR 0109584 A 20011201; CA 2404954 A 20011201; CN 01807261 A 20011201; CZ 20023687 A 20011201; DE 10104488 A 20010131; DE 50103688 T 20011201; EP 0114069 W 20011201; EP 01273588 A 20011201; ES 01273588 T 20011201; HU P0300088 A 20011201; JP 2002562127 A 20011201; KR 20027012665 A 20020925; MX PA02009430 A 20011201; PL 35620301 A 20011201; PT 01273588 T 20011201; SK 16172002 A 20011201; TR 200202244 T 20011201; TW 90129638 A 20011130; US 75467204 A 20040109; ZA 200207598 A 20020920