Global Patent Index - EP 1360000 A1

EP 1360000 A1 20031112 - DEVICE FOR CONNECTING MICROCOMPONENTS

Title (en)

DEVICE FOR CONNECTING MICROCOMPONENTS

Title (de)

EINRICHTUNG ZUR VERBINDUNG VON MIKROKOMPONENTEN

Title (fr)

DISPOSITIF POUR LA CONNEXION DE MICROCOMPOSANTS

Publication

EP 1360000 A1 20031112 (DE)

Application

EP 02711808 A 20020123

Priority

  • DE 10106996 A 20010215
  • EP 0200610 W 20020123

Abstract (en)

[origin: WO02064247A1] The invention relates to a device for connecting microcomponents (2), especially microreactors, which are preferably configured in the form of a plate and are preferably made of silicon. A sealing plate is arranged between the microcomponents (2). Said sealing plate is provided with openings (7) which correspond to openings (6) of the microcomponents (2).

IPC 1-7

B01J 19/00; B01L 3/00

IPC 8 full level

B81B 7/04 (2006.01); B01J 19/00 (2006.01); B01L 3/00 (2006.01); B01L 9/00 (2006.01); G01N 35/00 (2006.01)

CPC (source: EP KR US)

B01J 19/0093 (2013.01 - EP US); B01J 19/32 (2013.01 - KR); B01L 9/527 (2013.01 - EP US); B01J 2219/0081 (2013.01 - EP US); B01J 2219/00828 (2013.01 - EP US); B01L 3/5027 (2013.01 - EP US); B01L 2200/027 (2013.01 - EP US); B01L 2200/0689 (2013.01 - EP US); B01L 2300/0887 (2013.01 - EP US); G01N 2035/00326 (2013.01 - EP US); Y10T 29/49126 (2015.01 - EP US); Y10T 29/5313 (2015.01 - EP US); Y10T 29/53174 (2015.01 - EP US); Y10T 29/53252 (2015.01 - EP US)

Citation (search report)

See references of WO 02064247A1

Citation (examination)

PATENT ABSTRACTS OF JAPAN vol. 007, no. 253 (P - 235) 10 November 1983 (1983-11-10)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 02064247 A1 20020822; CA 2437965 A1 20020822; DE 10106996 A1 20020905; DE 10106996 C2 20030424; EP 1360000 A1 20031112; JP 2004529749 A 20040930; KR 100846639 B1 20080716; KR 20030080220 A 20031011; TW I268805 B 20061221; US 2004074084 A1 20040422; US 7060894 B2 20060613

DOCDB simple family (application)

EP 0200610 W 20020123; CA 2437965 A 20020123; DE 10106996 A 20010215; EP 02711808 A 20020123; JP 2002564035 A 20020123; KR 20037010566 A 20030811; TW 91102230 A 20020207; US 46808303 A 20030815