EP 1360718 A2 20031112 - INTEGRATED CIRCUIT ARRANGEMENT CONSISTING OF A FLAT SUBSTRATE
Title (en)
INTEGRATED CIRCUIT ARRANGEMENT CONSISTING OF A FLAT SUBSTRATE
Title (de)
INTEGRIERTE SCHALTUNGSANORDNUNG AUS EINEM FLÄCHIGEN SUBSTRAT
Title (fr)
ENSEMBLE CIRCUIT INTEGRE CONSTITUE D'UN SUBSTRAT PLAT
Publication
Application
Priority
- DE 0200191 W 20020122
- DE 10106836 A 20010214
Abstract (en)
[origin: WO02065548A2] The invention relates to an integrated circuit arrangement whose substrate has an integrated circuit that is configured on several layers, wherein at least one surface of the substrate does not have a planar configuration in the direction of propagation.
IPC 1-7
IPC 8 full level
H01L 21/52 (2006.01); H01L 23/13 (2006.01); H01L 23/58 (2006.01); H01L 29/06 (2006.01)
CPC (source: EP US)
H01L 23/13 (2013.01 - EP US); H01L 23/573 (2013.01 - EP US); H01L 29/0657 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01L 2924/3511 (2013.01 - EP US)
Citation (search report)
See references of WO 02065548A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02065548 A2 20020822; WO 02065548 A3 20021017; CN 100392846 C 20080604; CN 1541413 A 20041027; DE 10106836 A1 20020905; DE 10106836 B4 20090122; EP 1360718 A2 20031112; JP 2004523904 A 20040805; JP 3979942 B2 20070919; TW 519759 B 20030201; US 2004070052 A1 20040415; US 7199448 B2 20070403
DOCDB simple family (application)
DE 0200191 W 20020122; CN 02804978 A 20020122; DE 10106836 A 20010214; EP 02703497 A 20020122; JP 2002564764 A 20020122; TW 91101654 A 20020131; US 64126403 A 20030814