EP 1362372 A2 20031119 - ELECTROMIGRATION TEST STRUCTURE FOR DETERMINING THE RELIABILITY OF WIRING
Title (en)
ELECTROMIGRATION TEST STRUCTURE FOR DETERMINING THE RELIABILITY OF WIRING
Title (de)
ELEKTROMIGRATIONS-TESTSTRUKTUR ZUR ERFASSUNG EINER ZUVERLÄSSIGKEIT VON VERDRAHTUNGEN
Title (fr)
STRUCTURE D'ESSAI D'ELECTROMIGRATION POUR LA DETERMINATION DE LA FIABILITE DE CABLAGES
Publication
Application
Priority
- DE 0104599 W 20011207
- DE 10108915 A 20010223
Abstract (en)
[origin: WO02067318A2] The invention relates to an electromigration test structure for determining the reliability of wiring. An area which is to be tested, comprising an electromigration area (L) and an electromigration barrier area (V), is formed between a first and second test structure connection area (I1, I2). In order to assess life expectancy with precision and speed, a first and third sensor connector (S1, S3) is disposed in the immediate vicinity of the electromigration barrier area (V) and a second sensor connection (S2) is disposed on the second test structure (I2).
IPC 1-7
IPC 8 full level
H01L 23/544 (2006.01)
CPC (source: EP US)
G01R 31/2858 (2013.01 - EP US); H01L 22/34 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
See references of WO 02067318A2
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 02067318 A2 20020829; WO 02067318 A3 20030508; CN 1502132 A 20040602; DE 10108915 A1 20020912; EP 1362372 A2 20031119; US 2004036495 A1 20040226
DOCDB simple family (application)
DE 0104599 W 20011207; CN 01822839 A 20011207; DE 10108915 A 20010223; EP 01995590 A 20011207; US 64761503 A 20030825