EP 1362669 A3 20031210 - Polishing process and device for polishing of rotationally symmetric workpieces
Title (en)
Polishing process and device for polishing of rotationally symmetric workpieces
Title (de)
Polierverfahren und Vorrichtung zum Polieren rotationssymmetrischer Werkstücke
Title (fr)
Procédé et dispositif de polissage pour des pièces ayant une symétrie de rotation
Publication
Application
Priority
DE 10221842 A 20020516
Abstract (en)
[origin: EP1362669A2] The polishing process for the machine polishing of workpieces (F) involves immersing the workpiece in a container (12) filled with grinding material and moving it relative to the grinding material. The workpiece is moved up and down in the vertical direction, rotated about its own central axis (B) and moved with its central axis inside the container.
IPC 1-7
IPC 8 full level
B24B 31/00 (2006.01)
CPC (source: EP US)
B24B 31/003 (2013.01 - EP US)
Citation (search report)
- [X] EP 0922530 A2 19990616 - KAWASAKI SHUJI [JP]
- [XA] US 3566552 A 19710302 - HAMBRIGHT DUANE E
- [A] DE 2620477 A1 19771124 - OHNO IETATSU
- [A] US 4173851 A 19791113 - HIGASHI YASUNAGA [JP]
- [A] DE 3108685 A1 19820923 - BASF FARBEN & FASERN [DE]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR
DOCDB simple family (publication)
EP 1362669 A2 20031119; EP 1362669 A3 20031210; EP 1362669 B1 20060906; AT E338610 T1 20060915; AT E368547 T1 20070815; DE 10221842 A1 20031127; DE 50304919 D1 20061019; DE 50307841 D1 20070913; EP 1616664 A2 20060118; EP 1616664 A3 20060125; EP 1616664 B1 20070801; US 2003216110 A1 20031120; US 2005136802 A1 20050623; US 6918818 B2 20050719; US 7048613 B2 20060523
DOCDB simple family (application)
EP 03003748 A 20030219; AT 03003748 T 20030219; AT 05019364 T 20030219; DE 10221842 A 20020516; DE 50304919 T 20030219; DE 50307841 T 20030219; EP 05019364 A 20030219; US 39491003 A 20030320; US 5451405 A 20050208