EP 1364396 A4 20050831 - MICROPROTRUSION ARRAY AND METHODS OF MAKING A MICROPROTRUSION
Title (en)
MICROPROTRUSION ARRAY AND METHODS OF MAKING A MICROPROTRUSION
Title (de)
MIKROVORSPRUNGSARRAY UND VERFAHREN ZUR HERSTELLUNG EINES MIKROVORSPRUNGS
Title (fr)
RESEAU DE MICROPROTUBERANCES ET PROCEDES DE FORMATION D'UNE MICROPROTUBERANCE
Publication
Application
Priority
- US 0203206 W 20020205
- US 26643101 P 20010205
Abstract (en)
[origin: WO02062202A2] A microprotrusion array is formed from a silicon wafer by a plurality of sequential plasma and wet isotropic and anisotropic etching steps. The resulting microprotrusions have sharpened tips or cutting edges formed by a wet isotropic etch.
IPC 1-7
A61B 5/15; A61M 37/00; A61M 5/32; H01L 21/302; B44C 1/22; B61C 1/00
IPC 8 full level
A61B 5/15 (2006.01); A61M 5/32 (2006.01); A61M 35/00 (2006.01); A61M 37/00 (2006.01); B61C 1/00 (2006.01); B81B 1/00 (2006.01); B81C 1/00 (2006.01)
CPC (source: EP)
A61B 5/14514 (2013.01); A61B 5/150022 (2013.01); A61B 5/150282 (2013.01); A61B 5/150984 (2013.01); A61M 37/0015 (2013.01); B81C 1/00111 (2013.01); A61M 2037/003 (2013.01); A61M 2037/0053 (2013.01); B81B 2201/055 (2013.01); B81C 2201/0133 (2013.01)
Citation (search report)
- [X] WO 9964580 A1 19991216 - GEORGIA TECH RES INST [US]
- See references of WO 02062202A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02062202 A2 20020815; WO 02062202 A3 20021010; AU 2002250011 A1 20020819; EP 1364396 A2 20031126; EP 1364396 A4 20050831; JP 2004524172 A 20040812
DOCDB simple family (application)
US 0203206 W 20020205; AU 2002250011 A 20020205; EP 02718901 A 20020205; JP 2002562213 A 20020205