EP 1364399 A1 20031126 - SEMICONDUCTOR CHIP AND PRODUCTION METHOD FOR A HOUSING
Title (en)
SEMICONDUCTOR CHIP AND PRODUCTION METHOD FOR A HOUSING
Title (de)
HALBLEITERCHIP UND HERSTELLUNGSVERFAHREN FÜR EIN GEHÄUSE
Title (fr)
PUCE A SEMI-CONDUCTEUR ET PROCEDE DE PRODUCTION POUR UN BOITIER
Publication
Application
Priority
- DE 0200714 W 20020227
- DE 10109327 A 20010227
Abstract (en)
[origin: WO02069386A1] The invention relates to a selective covering, which covers the terminal contact surfaces (3, 4) and bonding wires (5) with a casting compound (8) and which leaves active areas exposed, particularly a contact area (6) for a finger in a fingerprint sensor. To this end, the chip surface is selectively adapted by the provision of a varying roughness or coating and/or the viscosity of the casting compound is modified by irradiating the same.
IPC 1-7
IPC 8 full level
H01L 23/28 (2006.01); G06K 9/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP US)
G06V 40/1306 (2022.01 - EP US); H01L 21/56 (2013.01 - EP US); H01L 23/3121 (2013.01 - EP US); H01L 23/3157 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/05554 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/45099 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2224/8592 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
Citation (search report)
See references of WO 02069386A1
Citation (examination)
- JP H1074869 A 19980317 - MOTOROLA INC
- EP 1041628 A2 20001004 - IMEC INTER UNI MICRO ELECTR [BE]
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02069386 A1 20020906; DE 10109327 A1 20020912; EP 1364399 A1 20031126; IL 157598 A0 20040328; JP 2004521497 A 20040715; US 2004159961 A1 20040819; US 6876090 B2 20050405
DOCDB simple family (application)
DE 0200714 W 20020227; DE 10109327 A 20010227; EP 02714075 A 20020227; IL 15759802 A 20020227; JP 2002568412 A 20020227; US 64941003 A 20030827