EP 1365479 A1 20031126 - ANISOTROPIC CONDUCTIVE CONNECTOR, ITS MANUFACTURE METHOD AND PROBE MEMBER
Title (en)
ANISOTROPIC CONDUCTIVE CONNECTOR, ITS MANUFACTURE METHOD AND PROBE MEMBER
Title (de)
"ANISOTROPER LEITFÄHIGER VERBINDER, HERSTELLUNGSVERFAHREN DAFÜR UND SONDENGLIED"
Title (fr)
CONNECTEUR CONDUCTEUR ANISOTROPE, SON PROCEDE DE FABRICATION ET SONDE
Publication
Application
Priority
- JP 0200959 W 20020206
- JP 2001033908 A 20010209
Abstract (en)
Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer to be inspected can be conducted with ease even when the wafer has a large area, and the pitch of electrodes to be inspected is small, and moreover good conductivity can be achieved as to all conductive parts, and insulating property between adjacent conductive parts can be achieved, a production process thereof, and a probe member. <??>The anisotropically conductive connector comprises a frame plate having a plurality of anisotropically conductive film-arranging holes formed corresponding to regions of electrodes to be inspected of a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes and supported by the inner peripheral edge thereabout. Each of the elastic anisotropically conductive films is composed of a functional part composed of a plurality of conductive parts arranged corresponding to the electrodes to be inspected, containing conductive particles exhibiting magnetism at a high density and extending in the thickness-wise direction of the film and insulating parts mutually insulating these conductive parts, and a supported part integrally formed at a peripheral edge of the functional part and fixed to the inner periphery about the anisotropically conductive film-arranging hole. The supported part contains the conductive particles exhibiting magnetism. <IMAGE>
IPC 1-7
IPC 8 full level
H01R 11/01 (2006.01); G01R 1/06 (2006.01); G01R 1/073 (2006.01); G01R 31/26 (2006.01); H01L 21/66 (2006.01); H01R 13/24 (2006.01); H01R 43/00 (2006.01)
CPC (source: EP KR US)
H01B 5/16 (2013.01 - KR); H01R 13/2414 (2013.01 - EP US); H01R 43/007 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1365479 A1 20031126; EP 1365479 A4 20071226; EP 1365479 B1 20110105; AT E494645 T1 20110115; CN 1246932 C 20060322; CN 1496597 A 20040512; DE 60238824 D1 20110217; JP 2002324600 A 20021108; JP 2002334732 A 20021122; JP 2005056860 A 20050303; JP 3788361 B2 20060621; JP 3804542 B2 20060802; JP 3807432 B2 20060809; KR 100577947 B1 20060510; KR 20030083710 A 20031030; TW 533624 B 20030521; US 2006033100 A1 20060216; US 6969622 B1 20051129; US 7323712 B2 20080129; WO 02065588 A1 20020822
DOCDB simple family (application)
EP 02711328 A 20020206; AT 02711328 T 20020206; CN 02806241 A 20020206; DE 60238824 T 20020206; JP 0200959 W 20020206; JP 2002030620 A 20020207; JP 2002030621 A 20020207; JP 2004320741 A 20041104; KR 20037010446 A 20030808; TW 91102235 A 20020207; US 20517405 A 20050817; US 47074603 A 20030811