EP 1366219 A2 20031203 - BATH FOR THE GALVANIC DEPOSITION OF GOLD ALLOYS AND THE USE THEREOF
Title (en)
BATH FOR THE GALVANIC DEPOSITION OF GOLD ALLOYS AND THE USE THEREOF
Title (de)
BAD ZUR GALVANISCHEN ABSCHEIDUNG VON GOLDLEGIERUNGEN SOWIE DESSEN VERWENDUNG
Title (fr)
BAIN ELECTROLYTIQUE POUR DEPOSER DES ALLIAGES EN OR ET SON UTILISATION
Publication
Application
Priority
- EP 02744906 A 20020228
- DE 10110743 A 20010228
- EP 0202128 W 20020228
- EP 01108448 A 20010404
Abstract (en)
[origin: WO02068728A1] The invention relates to a bath for the galvanic deposition of gold and gold alloys, and to the use thereof for producing dental shaped elements, wherein the gold is present in the form of a gold sulfite complex. The inventive bath and the inventive use are characterized in that at least one bismuth compound is present in addition to the optional other metals and conventional additives for gold sulfites of the above-described kind. The bismuth compound is preferably a complex compound, especially one that contains the complexing agents NTA, HEDTA, TEPA, DTPA, EDNTA or EDTA. The invention has several advantages, the most important being that the bismuth can be added to the bath already when it is prepared. The invention provides for a bath that is functional for a long period and that does not necessarily require the addition of other additives before galvanization.
IPC 1-7
IPC 8 full level
A61K 6/04 (2006.01); A61K 6/884 (2020.01); C25D 3/48 (2006.01); C25D 3/62 (2006.01); C25D 5/18 (2006.01); C25D 7/00 (2006.01)
CPC (source: EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02068728 A1 20020906; WO 02068728 A8 20030918; AU 2002308221 A1 20020912; BR 0207724 A 20040323; CA 2438207 A1 20020906; CN 100392155 C 20080604; CN 1494606 A 20040505; EP 1366219 A2 20031203; EP 1366219 B1 20140903; JP 2004527653 A 20040909; JP 4183240 B2 20081119; US 2004065225 A1 20040408
DOCDB simple family (application)
EP 0202128 W 20020228; AU 2002308221 A 20020228; BR 0207724 A 20020228; CA 2438207 A 20020228; CN 02805673 A 20020228; EP 02744906 A 20020228; JP 2002568818 A 20020228; US 46914603 A 20030827