EP 1366519 A2 20031203 - COOLING DEVICE
Title (en)
COOLING DEVICE
Title (de)
KÜHLVORRICHTUNG
Title (fr)
DISPOSITIF DE REFROIDISSEMENT
Publication
Application
Priority
- DE 0102865 W 20010728
- DE 10039770 A 20000816
Abstract (en)
[origin: WO0215268A2] The invention relates to a cooling device for at least one semiconductor and/or at least one integrated electronic circuit that is linked with a thermoconducting element. Said cooling device comprises a heat sink that is linked with the thermoconducting element so as to conduct heat. Said thermoconducting element, on the side facing the heat sink, is provided with structures that enlarge its surface. The invention is further characterized in that the heat sink (W), on its side facing the thermoconducting element (7), is provided with counterstructures (10) that enlarge its surface and that engage with the structures (9).
IPC 1-7
IPC 8 full level
H01L 23/40 (2006.01)
CPC (source: EP)
H01L 23/4006 (2013.01); F28F 3/048 (2013.01); F28F 3/12 (2013.01); H01L 2224/48227 (2013.01)
Citation (search report)
See references of WO 0215268A2
Citation (examination)
JP 2000228470 A 20000815 - HEWLETT PACKARD CO
Designated contracting state (EPC)
CH DE GB LI
DOCDB simple family (publication)
WO 0215268 A2 20020221; WO 0215268 A3 20031009; DE 10039770 A1 20020228; EP 1366519 A2 20031203
DOCDB simple family (application)
DE 0102865 W 20010728; DE 10039770 A 20000816; EP 01956404 A 20010728