Global Patent Index - EP 1368821 A1

EP 1368821 A1 20031210 - ARRANGEMENT AND METHOD FOR THE REAR-FACED CONTACTING OF A SEMICONDUCTOR SUBSTRATE

Title (en)

ARRANGEMENT AND METHOD FOR THE REAR-FACED CONTACTING OF A SEMICONDUCTOR SUBSTRATE

Title (de)

ANORDNUNG UND VERFAHREN ZUM RUCKSEITIGEN KONTAKTIEREN EINES HALBLEITERSUBSTRATS

Title (fr)

ENSEMBLE ET PROCEDE DE MISE EN CONTACT COTE ARRIERE D'UN SUBSTRAT SEMI-CONDUCTEUR

Publication

EP 1368821 A1 20031210 (DE)

Application

EP 02714062 A 20020222

Priority

  • DE 0200670 W 20020222
  • DE 10111761 A 20010312

Abstract (en)

[origin: WO02073663A1] A base body (21) is provided on which a first sealing ring (23) and a second sealing ring (24) are arranged. A substrate (1) is arranged on the sealing rings such that a cavity (25) is formed between the first sealing ring (23), the second sealing ring (24), the base body (21) and the substrate (1). An etching substance for etching a conducting layer applied to the substrate (1) may be introduced into the cavity (25). Should a conducting layer (5), applied to the rear face of the substrate be exposed, an electrolyte can be filled into the cavity (25) which contacts the conducting layer (5) and thus the substrate rear face.

IPC 1-7

H01L 21/00

IPC 8 full level

H01L 21/00 (2006.01)

CPC (source: EP US)

H01L 21/67086 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)

C-Set (source: EP US)

H01L 2924/0002 + H01L 2924/00

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 02073663 A1 20020919; DE 10111761 A1 20021002; EP 1368821 A1 20031210; TW 550708 B 20030901; US 2004104402 A1 20040603; US 6863769 B2 20050308

DOCDB simple family (application)

DE 0200670 W 20020222; DE 10111761 A 20010312; EP 02714062 A 20020222; TW 91104120 A 20020306; US 66134003 A 20030912