EP 1368821 A1 20031210 - ARRANGEMENT AND METHOD FOR THE REAR-FACED CONTACTING OF A SEMICONDUCTOR SUBSTRATE
Title (en)
ARRANGEMENT AND METHOD FOR THE REAR-FACED CONTACTING OF A SEMICONDUCTOR SUBSTRATE
Title (de)
ANORDNUNG UND VERFAHREN ZUM RUCKSEITIGEN KONTAKTIEREN EINES HALBLEITERSUBSTRATS
Title (fr)
ENSEMBLE ET PROCEDE DE MISE EN CONTACT COTE ARRIERE D'UN SUBSTRAT SEMI-CONDUCTEUR
Publication
Application
Priority
- DE 0200670 W 20020222
- DE 10111761 A 20010312
Abstract (en)
[origin: WO02073663A1] A base body (21) is provided on which a first sealing ring (23) and a second sealing ring (24) are arranged. A substrate (1) is arranged on the sealing rings such that a cavity (25) is formed between the first sealing ring (23), the second sealing ring (24), the base body (21) and the substrate (1). An etching substance for etching a conducting layer applied to the substrate (1) may be introduced into the cavity (25). Should a conducting layer (5), applied to the rear face of the substrate be exposed, an electrolyte can be filled into the cavity (25) which contacts the conducting layer (5) and thus the substrate rear face.
IPC 1-7
IPC 8 full level
H01L 21/00 (2006.01)
CPC (source: EP US)
H01L 21/67086 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02073663 A1 20020919; DE 10111761 A1 20021002; EP 1368821 A1 20031210; TW 550708 B 20030901; US 2004104402 A1 20040603; US 6863769 B2 20050308
DOCDB simple family (application)
DE 0200670 W 20020222; DE 10111761 A 20010312; EP 02714062 A 20020222; TW 91104120 A 20020306; US 66134003 A 20030912