EP 1370835 A2 20031217 - SENSOR CHIP WITH ADDITIONAL HEATING ELEMENT, METHOD FOR PREVENTING A SENSOR CHIP FROM BEING SOILED, AND USE OF AN ADDITIONAL HEATING ELEMENT ON A SENSOR CHIP
Title (en)
SENSOR CHIP WITH ADDITIONAL HEATING ELEMENT, METHOD FOR PREVENTING A SENSOR CHIP FROM BEING SOILED, AND USE OF AN ADDITIONAL HEATING ELEMENT ON A SENSOR CHIP
Title (de)
SENSORCHIP MIT ZUSATZHEIZER BZW. VERFAHREN ZUR VERMEIDUNG VON VERSCHMUTZUNGEN AUF EINEM SENSORCHIP BZW. VERWENDUNG EINES ZUSATZHEIZERS AUF EINEM SENSORCHIP
Title (fr)
PUCE DE DETECTION AVEC ELEMENT CHAUFFANT ADDITIONNEL, PROCEDE PERMETTANT D'EVITER LA FORMATION DE SALISSURES SUR UNE PUCE DE DETECTION ET UTILISATION D'UN ELEMENT CHAUFFANT SUPPLEMENTAIRE SUR UNE PUCE DE DETECTION
Publication
Application
Priority
- DE 0200894 W 20020313
- DE 10111840 A 20010313
Abstract (en)
[origin: WO02073140A2] In conventional sensor chips contaminations of a flowing medium can deposit in the area of the sensor and can permanently soil it, resulting in a negative influence on the measuring behavior of the membrane. The inventive sensor chip (1) is characterized in that an additional heating element (39) is provided that is arranged upstream and at a distinct distance to the sensor area. As a result, the contaminations of the flowing medium deposit in the area of the additional heating element (39) and are thus prevented from reaching the sensor area (17).
IPC 1-7
IPC 8 full level
G01F 1/68 (2006.01); G01F 1/684 (2006.01); G01F 1/692 (2006.01); G01F 1/696 (2006.01); G01F 1/699 (2006.01)
CPC (source: EP KR US)
G01F 1/6845 (2013.01 - EP KR US); G01F 1/692 (2013.01 - KR); G01F 1/699 (2013.01 - EP KR US)
Citation (search report)
See references of WO 02073140A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02073140 A2 20020919; WO 02073140 A3 20021031; CN 1278106 C 20061004; CN 1459020 A 20031126; DE 10111840 A1 20021002; DE 10111840 C2 20030605; EP 1370835 A2 20031217; JP 2004518982 A 20040624; KR 20020093099 A 20021212; US 2003154807 A1 20030821; US 6845660 B2 20050125
DOCDB simple family (application)
DE 0200894 W 20020313; CN 02800601 A 20020313; DE 10111840 A 20010313; EP 02727222 A 20020313; JP 2002572356 A 20020313; KR 20027014559 A 20021030; US 27618303 A 20030409