EP 1373129 A2 20040102 - METHOD FOR PRODUCING MICROMECHANIC SENSORS AND SENSORS PRODUCED BY SAID METHOD
Title (en)
METHOD FOR PRODUCING MICROMECHANIC SENSORS AND SENSORS PRODUCED BY SAID METHOD
Title (de)
VERFAHREN ZUR HERSTELLUNG VON MIKROMECHANISCHEN SENSOREN UND DAMIT HERGESTELLTE SENSOREN
Title (fr)
PROCEDE DE PRODUCTION DE DETECTEURS MICROMECANIQUES, ET DETECTEURS AINSI OBTENUS
Publication
Application
Priority
- DE 0200883 W 20020313
- DE 10114036 A 20010322
Abstract (en)
[origin: WO02076880A2] The invention relates to a method for producing micromechanic sensors, and the sensors produced thereby, in which openings (2) are made in a semiconductor substrate (1). A subsequent temperature treatment is carried out after the openings (2) have been made in the semiconductor substrate (1), converting said openings (2) into cavities in the depth of the substrate (1).
IPC 1-7
IPC 8 full level
B81B 3/00 (2006.01); B81C 1/00 (2006.01); G01L 9/00 (2006.01); H01L 29/84 (2006.01)
CPC (source: EP US)
B81C 1/00047 (2013.01 - EP US); B81C 1/00246 (2013.01 - EP US); G01L 9/0042 (2013.01 - EP US); G01L 9/0045 (2013.01 - EP US); G01L 9/0055 (2013.01 - EP US); B81B 2203/033 (2013.01 - EP US); B81C 2201/0116 (2013.01 - EP US); B81C 2203/0742 (2013.01 - EP US)
Citation (search report)
See references of WO 02076880A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02076880 A2 20021003; WO 02076880 A3 20031002; DE 10114036 A1 20021002; EP 1373129 A2 20040102; JP 2004531882 A 20041014; US 2004152228 A1 20040805; US 7045382 B2 20060516
DOCDB simple family (application)
DE 0200883 W 20020313; DE 10114036 A 20010322; EP 02729780 A 20020313; JP 2002576148 A 20020313; US 47265004 A 20040326