EP 1373588 A1 20040102 - MICRO-ALLOYED OXYGEN-FREE COPPER ALLOY AND ITS USE
Title (en)
MICRO-ALLOYED OXYGEN-FREE COPPER ALLOY AND ITS USE
Title (de)
MIKROLEGIERTE SAUERSTOFFFREIE KUPFERLEGIERUNG UND IHRE VERWENDUNG
Title (fr)
ALLIAGE DE CUIVRE EXEMPT D'OXYGENE MICROALLIE ET UTILISATION DE CELUI-CI
Publication
Application
Priority
- FI 0200184 W 20020308
- FI 20010473 A 20010309
Abstract (en)
[origin: WO02072901A1] An oxygen-free copper alloy comprising oxygen-free copper and, micro-alloyed therein, about 1 250 ppm tin (Sn) and/or about 1 150 ppm manganese (Mn). The invention also relates to the use of said copper alloy.
IPC 1-7
IPC 8 full level
C22C 9/02 (2006.01); C22C 9/05 (2006.01); H01B 1/02 (2006.01)
CPC (source: EP US)
C22C 9/02 (2013.01 - EP US); C22C 9/05 (2013.01 - EP US); H01B 1/026 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02072901 A1 20020919; BR 0207879 A 20040302; CN 1496416 A 20040512; CZ 20032372 A3 20031217; EP 1373588 A1 20040102; FI 113061 B 20040227; FI 20010473 A0 20010309; FI 20010473 A 20020910; HU P0303470 A2 20040128; HU P0303470 A3 20051028; JP 2004538362 A 20041224; PL 363969 A1 20041129; SK 11512003 A3 20040406; US 2004096353 A1 20040520
DOCDB simple family (application)
FI 0200184 W 20020308; BR 0207879 A 20020308; CN 02806243 A 20020308; CZ 20032372 A 20020308; EP 02703649 A 20020308; FI 20010473 A 20010309; HU P0303470 A 20020308; JP 2002571950 A 20020308; PL 36396902 A 20020308; SK 11512003 A 20020308; US 47119103 A 20030909