EP 1374654 A1 20040102 - HEAT SINK
Title (en)
HEAT SINK
Title (de)
KÜHLKÖRPER
Title (fr)
DRAIN THERMIQUE
Publication
Application
Priority
- GB 0106547 A 20010316
- US 0207904 W 20020314
- US 93935601 A 20010824
Abstract (en)
[origin: WO02076166A1] A composite heat sink device (1) includes a heat sink body (2, 3) formed of aluminum, the body (2, 3) having a pair of coplanar surfaces (4), and a thermally conductive solderable element (5), for example of copper, mechanically fixed to each of the coplanar surfaces (4). Each of the solderable elements has a first surface which is contiguous with one of the coplanar surfaces, and a second surface which is soldered to a printed circuit board.
IPC 1-7
IPC 8 full level
H05K 7/20 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP)
H01L 23/3672 (2013.01); H01L 23/40 (2013.01); H01L 23/4093 (2013.01); H05K 3/341 (2013.01); H01L 2924/0002 (2013.01); H05K 3/3421 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10909 (2013.01); H05K 2201/10916 (2013.01); H05K 2201/2081 (2013.01); H05K 2203/0315 (2013.01); Y02P 70/50 (2015.11)
C-Set (source: EP)
Designated contracting state (EPC)
AT BE CH CY DE FR GB IT LI
DOCDB simple family (publication)
WO 02076166 A1 20020926; WO 02076166 A9 20030130; CN 1516996 A 20040728; EP 1374654 A1 20040102; EP 1374654 A4 20041020; JP 2004523921 A 20040805; TW 526697 B 20030401
DOCDB simple family (application)
US 0207904 W 20020314; CN 02806690 A 20020314; EP 02753633 A 20020314; JP 2002573500 A 20020314; TW 91104930 A 20020315