Global Patent Index - EP 1378151 A1

EP 1378151 A1 20040107 - CONNECTING METHOD FOR STRUCTURE WITH IMPLANTABLE ELECTRODES

Title (en)

CONNECTING METHOD FOR STRUCTURE WITH IMPLANTABLE ELECTRODES

Title (de)

VERBINDUNGSVERFAHREN FÜR IMPLANTIERBARE STRUKTUR MIT ELEKTRODEN

Title (fr)

PROCEDE DE CONNEXION POUR STRUCTURE A ELECTRODES IMPLANTABLE

Publication

EP 1378151 A1 20040107 (FR)

Application

EP 02732808 A 20020411

Priority

  • FR 0201269 W 20020411
  • FR 0105053 A 20010412

Abstract (en)

[origin: FR2823633A1] The electrical pad connection method connects a first pad (16) of a structure (1) to an electrode carrier to measure activity on second pads (17) connected to a circuit (2). The second pads have a central opening (15). The construction method has the circuit placed on the structure so that the central opening faces the first pad. The central opening is then filled with conductor material (18) assuring connection between the first and second pad.

IPC 1-7

H05K 3/36

IPC 8 full level

H05K 1/11 (2006.01); A61B 5/0408 (2006.01); H05K 3/36 (2006.01); H05K 3/32 (2006.01)

CPC (source: EP US)

A61B 5/282 (2021.01 - EP US); H05K 3/361 (2013.01 - EP US); H05K 3/363 (2013.01 - EP US); A61B 2562/222 (2013.01 - EP US); H05K 1/118 (2013.01 - EP US); H05K 3/321 (2013.01 - EP US); H05K 2201/053 (2013.01 - EP US); H05K 2201/09472 (2013.01 - EP US); H05K 2201/10477 (2013.01 - EP US); H05K 2201/10666 (2013.01 - EP US); H05K 2203/0455 (2013.01 - EP US)

Citation (search report)

See references of WO 02085085A1

Citation (examination)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

FR 2823633 A1 20021018; FR 2823633 B1 20030912; EP 1378151 A1 20040107; JP 2004521507 A 20040715; JP 4075615 B2 20080416; US 2004163841 A1 20040826; US 7090505 B2 20060815; WO 02085085 A1 20021024

DOCDB simple family (application)

FR 0105053 A 20010412; EP 02732808 A 20020411; FR 0201269 W 20020411; JP 2002582674 A 20020411; US 47433204 A 20040423