Global Patent Index - EP 1378590 A1

EP 1378590 A1 20040107 - Bath for gold electro deposition

Title (en)

Bath for gold electro deposition

Title (de)

Bad für goldgalvanischen Goldüberzug

Title (fr)

Bain pour dépôts electrolytiques d'or

Publication

EP 1378590 A1 20040107 (FR)

Application

EP 02405558 A 20020704

Priority

EP 02405558 A 20020704

Abstract (en)

A bath for the electrolytic deposition of gold comprises, in solution in water, a gold sulfite, a grain refiner, an inhibitor and a conducting salt. The grain refiner is chosen from soluble compounds of bismuth, tin, tellurium and selenium. Preferred Features: The soluble bismuth compound is a soluble complex of ammonium citrate and bismuth. The inhibitor contains a derivative of phosphonic acid. The conducting salt is ammonium sulfite. The bath may also contain 20-100 g/liter, preferably 50 g/liter, of amidosulphonic acid.

Abstract (fr)

La présente invention concerne un bain pour dépôt électrolytique d'or, comportant, en solution dans de l'eau, du sulfite d'or, un affineur de grain, un complexant et un sel conducteur, caractérisé en ce que ledit affineur de grain est choisi parmi des composés solubles de bismuth, d'étain, de tellure et de sélénium.

IPC 1-7

C25D 3/48

IPC 8 full level

C25D 3/48 (2006.01)

CPC (source: EP)

C25D 3/48 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

DOCDB simple family (publication)

EP 1378590 A1 20040107; AT E307918 T1 20051115; AU 2003240347 A1 20040123; DE 60302074 D1 20051201; DE 60302074 T2 20060713; EP 1520063 A1 20050406; EP 1520063 B1 20051026; ES 2252673 T3 20060516; WO 2004005589 A1 20040115

DOCDB simple family (application)

EP 02405558 A 20020704; AT 03729763 T 20030620; AU 2003240347 A 20030620; CH 0300400 W 20030620; DE 60302074 T 20030620; EP 03729763 A 20030620; ES 03729763 T 20030620